Solid state drive device and computer server system including the same

Patent metadata

Field	Value
Publication number	US-11558980-B2
Application number	US-202217665518-A
Country	US
Kind code	B2
Filing date	Feb 5, 2022
Priority date	Nov 5, 2018
Publication date	Jan 17, 2023
Grant date	Jan 17, 2023

Abstract

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

First claim

What is claimed is:

1. A solid-state drive device comprising:
a first module including at least one volatile main memory device, a controller and at least one first nonvolatile memory device, the first module having a first region containing the at least one volatile main memory device and the controller and a second region containing the at least one first nonvolatile memory device;
a second module disposed on the first module, the second module overlapping the second region of the first module as viewed in a plan view of the solid-state drive device, the second module including at least one second nonvolatile memory device and having a third region containing the at least one second nonvolatile memory device; and
a heat dissipating member disposed on the second module such that the second module is interposed between the heat dissipating member and the first module, having a first surface disposed toward the first module and a second surface opposite the first surface, and elongated in one direction,
wherein the heat dissipating member has a plate-shaped portion and a protruding portion disposed at the first surface,
the protruding portion protrudes toward the first module relative to the plate-shaped portion and is in direct thermal contact with the first region of the first module,
the protruding portion has at least one first air passageway extending therethrough in the one direction above the at least one volatile main memory device and at least one second air passageway extending therethrough in the one direction above the controller, and
the plate-shaped portion is in direct thermal contact with the third region of the second module.

2. The solid-state drive device of claim 1 , wherein each of the at least one second air passageway extends from each of the at least one first air passageway.

3. The solid-state drive device of claim 1 , wherein a number of the at least one first air passageway is the same with a number of at least one second air passageway.

4. The solid-state drive device of claim 1 , wherein a cross-sectional are the at least one first air passageway is substantially the same with a cross-sectional area of the at least one second air passageway.

5. The solid-state drive device of claim 1 , wherein the at least one first air passageway and the at least one second air passageway are hollow tubes.

6. The solid-state drive device of claim 1 , wherein the at least one first air passageway and the at least one second air passageway are grooves concavely formed in the first surface of the heat dissipation member.

7. The solid-state drive device of claim 1 , wherein the at least one first air passageway and the at least one second air passageway are grooves concavely formed in the second surface of the heat dissipation member.

8. The solid-state drive device of claim 7 , wherein the heat dissipating member further includes at least one groove disposed the plate-shaped portion and arranged in the one direction.

9. A solid-state drive device comprising:
a first module including at least one volatile main memory device, a controller and at least one first nonvolatile memory device, the first module having a first region containing the at least one volatile main memory device and the controller and a second region containing the at least one first nonvolatile memory device;
a second module disposed on the first module, the second module overlapping the second region of the first module as viewed in a plan view of the solid-state drive device, the second module including at least one second nonvolatile memory device, having a third region containing the at least one second nonvolatile memory device, and having a open region; and
a heat dissipating member disposed on the second module such that the second module is interposed between the heat dissipating member and the first module, having a first surface disposed toward the first module and a second surface opposite the first surface, and elongated in one direction,
wherein the heat dissipating member has a first protruding portion and a second protruding portion disposed at the first surface penetrating the open region of the second module,
the first protruding portion protrudes toward the first module and the second protruding portion protrudes toward the second module, and the first protruding portion is in direct thermal contact with the first region of the first module and the second protruding portion is in direct thermal contact with the third region of the second module,
the first protruding portion has at least one first air passageway extending therethrough in the one direction above the at least one volatile main memory device and at least one second air passageway extending therethrough in the one direction above the controller, and
the second protruding portion has at least one third air passageway extending therethrough in the one direction above the at least one second nonvolatile memory device.

10. The solid-state drive device of claim 9 , wherein each of the at least one second air passageway extends from each of the at least one first air passageway, and each of the at least one third air passageway extends from each of the at least one first air passageway or each of the at least one second air passageway.

11. The solid-state drive device of claim 9 , wherein a number of the at least one first air passageway is the same with a number of at least one second air passageway, and a number of the at least one third air passageway is less than or equal to the number of at least one second air passageway.

12. The solid-state drive device of claim 9 , wherein the open region has a first part overlying the second region and a second part overlying the first region.

13. The solid-state drive device of claim 12 , wherein the third region is divided into two parts by the second part.

14. The solid-state drive device of claim 12 , wherein a width of the second protruding portion is smaller than a width of the first protruding portion.

15. The solid-state drive device of claim 12 , wherein a width of the second protruding portion is substantially the same with a width of the first protruding portion.

16. The solid-state drive device of claim 9 , wherein the second module has a rectangular shape.

17. The solid-state drive device of claim 16 , wherein the third region is disposed parallel to the first protruding portion and the second protruding portion.

18. The solid-state drive device of claim 9 , wherein the first region and the second region are arranged in the one direction.

19. The solid-state drive device of claim 9 , wherein the second protruding portion extends from the first protruding portion in the one direction.

20. The solid-state drive device of claim 9 , wherein the controller is disposed closer to the second region than the at least one volatile main memory device.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Hur Sung Chul
• Kong Do Il

Classifications

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20172

  Fan mounting or fan specifications · CPC title

• H05K7/20727 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20409 Primary

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title