Heat sink and memory module having the same

Patent metadata

Field	Value
Publication number	US-9894805-B2
Application number	US-201615229766-A
Country	US
Kind code	B2
Filing date	Aug 5, 2016
Priority date	Oct 8, 2015
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.

First claim

What is claimed is:

1. A heat sink for a memory module, the heat sink comprising:
a thermally conductive base plate configured to be mounted on a module board;
a plurality of radiation fins protruding outwardly from the base plate; and
a pocket cover extending outwardly from an opening formed in the base plate, wherein the pocket cover covers a passive device, on the module board, that protrudes through the opening, wherein the pocket cover comprises:
a first portion extending from an upper surface of the base plate and configured to cover a side surface of the passive device; and
a second portion extending orthogonally from the first portion and configured to cover a top surface of the passive device.

2. The heat sink of claim 1 , wherein the pocket cover has an opening that exposes a space beneath the pocket cover to a surrounding environment.

3. The heat sink of claim 1 , wherein a recessed portion is formed in a lower surface of the base plate and is configured to cover an upper portion of a semiconductor device mounted on the module board.

4. The heat sink of claim 1 , wherein a height of the pocket cover from an upper surface of the base plate is the same as a height of the radiation fins.

5. The heat sink of claim 1 , further comprising a cushion pad on an inner surface of the pocket cover that is configured to contact the passive device and cushion the passive device from impact.

6. The heat sink of claim 1 , wherein the radiation fins extend in a first direction and the pocket cover extends in a direction parallel with the first direction.

7. The heat sink of claim 1 , wherein the base plate comprises a threaded receptacle configured to receive a fastener therein for securing the heat sink to the module board.

8. The heat sink of claim 1 , wherein the base plate comprises a guide pin that facilitates alignment of the heat sink with the module board.

9. The heat sink of claim 1 , wherein the memory module is a card-type solid state drive.

10. A memory module, comprising:
a module board;
at least one semiconductor device and at least one passive device mounted on the module board; and
a heat sink thermally coupled to the module board,
the heat sink comprising:
a thermally conductive base plate covering the module board;
a plurality of radiation fins protruding outwardly from the base plate; and
a pocket cover extending outwardly from an opening formed in the base plate, wherein the opening corresponds to a location of the at least one passive device on the module board, wherein the pocket cover is configured to cover the at least one passive device that protrudes through the opening, and wherein the pocket cover comprises:
a first portion extending from an upper surface of the base plate and configured to cover a side surface of the at least one passive device; and
a second portion extending orthogonally from the first portion and configured to cover a top surface of the at least one passive device.

11. The memory module of claim 10 , wherein the pocket cover comprises an opening that exposes a space beneath the pocket cover to a surrounding environment.

12. The memory module of claim 10 , wherein a recessed portion is formed in a lower surface of the base plate and is configured to cover an upper portion of the semiconductor device.

13. The memory module of claim 10 , wherein the heat sink further comprises a cushion pad on an inner surface of the pocket cover that is configured to contact the at least one passive device and cushion the at least one passive device from impact.

14. A memory module, comprising:
a module board; and
a heat sink comprising:
a thermally conductive base plate configured to be mounted to the module board;
a first plurality of radiation fins protruding outwardly from a first portion of the base plate;
a second plurality of radiation fins protruding outwardly from a second portion of the base plate; and
a pocket cover extending outwardly from an opening formed in the base plate between the first and second portions of the base plate, wherein the pocket cover is configured to cover a passive device, on the module board, that protrudes through the opening.

15. The memory module of claim 14 , wherein a height of the pocket cover from an upper surface of the base plate is greater than or equal to a height of the first and second plurality of radiation fins.

16. The memory module of claim 14 , wherein a height of the pocket cover from an upper surface of the base plate is less than a height of the first and second plurality of radiation fins.

17. The memory module of claim 14 , wherein a height of the first plurality of radiation fins from an upper surface of the base plate is different from a height of the second plurality of radiation fins from the upper surface of the base plate.

18. The memory module of claim 14 , wherein a recessed portion is formed in a lower surface of at least one of the base plate first and second portions and is configured to cover an upper portion of a semiconductor device on the module board.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Ji Yong
• Kim Yu Sung
• Ryu Chung Hyun
• Lee Sung Ki

Classifications

• H05K7/20409 Primary

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• F28F2215/04

  Assemblies of fins having different features, e.g. with different fin densities · CPC title

• F28F3/04

  the means being integral with the element · CPC title

• F28F27/00

  Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus (control arrangements in general G05) · CPC title

• F28D2021/0029

  Heat sinks · CPC title