Substrate bonding device, calculation device, substrate bonding method, and calculation method
US-2021242044-A1 · Aug 5, 2021 · US
Bonding method for cleaning non-bonding surface of substrate
US11626302B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11626302-B2 |
| Application number | US-202217813369-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 19, 2022 |
| Priority date | Mar 13, 2019 |
| Publication date | Apr 11, 2023 |
| Grant date | Apr 11, 2023 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
First claim
Opening claim text (preview).
We claim: 1. A bonding method, comprising: modifying a bonding surface of a first substrate and a bonding surface of a second substrate; hydrophilizing the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; bonding the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and cleaning, before the bonding is performed, a non-bonding surface opposite to the bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed. 2. The bonding method of claim 1 , wherein the cleaning comprises polishing the non-bonding surface. 3. The bonding method of claim 1 , wherein the cleaning comprises roughening the non-bonding surface. 4. The bonding method of claim 3 , wherein the cleaning comprises roughening the non-bonding surface of, between the first substrate and the second substrate, one which is deformed when the bonding is performed, except a peripheral portion thereof. 5. The bonding method of claim 1 , wherein the cleaning comprises cleaning a peripheral portion of the non-bonding surface. 6. The bonding method of claim 1 , further comprising: inspecting, before the bonding is performed, presence or absence of a deposit adhering to the non-bonding surface. 7. The bonding method of claim 6 , wherein the cleaning is performed before the inspecting. 8. The bonding method of claim 6 , wherein the cleaning is performed after the inspecting. 9. The bonding method of claim 6 , further comprising: cleaning the non-bonding surface which is found to have the deposit as a result of the inspecting.
Assignees
Inventors
Classifications
Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title
Monitoring of warpages, curvatures, damages, defects or the like · CPC title
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
- H10P10/128Primary
by direct semiconductor to semiconductor bonding · CPC title
- H10P72/0428Primary
Apparatus for mechanical treatment or grinding or cutting · CPC title
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Frequently asked questions
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- What does patent US11626302B2 cover?
- A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydroph…
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P10/128. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 11 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).