Bonding layer and process
US-12582017-B2 · Mar 17, 2026 · US
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Mimura Yuji patents
Mimura Yuji is listed as an inventor on 27 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mimura Yuji |
| Total patents | 27 |
| First publication | May 14, 2015 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Surface modifying apparatus and bonding strength determination method
US-12469685-B2 · Nov 11, 2025 · US
Bonding system and inspection method of inspecting combined substrate
US-12451374-B2 · Oct 21, 2025 · US
Bonding system and surface modification method
US-12394749-B2 · Aug 19, 2025 · US
Bonding method and bonding system
US-2025029950-A1 · Jan 23, 2025 · US
Separating method, separating apparatus, and separating system
US-12157293-B2 · Dec 3, 2024 · US
Bonding layer and process
US-2024234363-A1 · Jul 11, 2024 · US
Bonding layer and process
US-2024170444-A1 · May 23, 2024 · US
Surface modifying apparatus and bonding strength determination method
US-2024079222-A1 · Mar 7, 2024 · US
Surface modifying method and surface modifying apparatus
US-2024079214-A1 · Mar 7, 2024 · US
Recent patents
Latest publications not already listed above.
Measuring method and measuring device
US-11791182-B2 · Oct 17, 2023 · US
Bonding method for cleaning non-bonding surface of substrate
US-11626302-B2 · Apr 11, 2023 · US
Separating method, separating apparatus, and separating system
US-2023055853-A1 · Feb 23, 2023 · US
Bonding system and inspection method of inspecting combined substrate
US-2022415673-A1 · Dec 29, 2022 · US
Bonding system and surface modification method
US-2022384386-A1 · Dec 1, 2022 · US
Bonding method for cleaning non-bonding surface of substrate
US-2022351987-A1 · Nov 3, 2022 · US
Bonding system with cleaning apparatus for cleaning non-bonding surface of substrate
US-11424142-B2 · Aug 23, 2022 · US
Method and structure for low density silicon oxide for fusion bonding and debonding
US-11315789-B2 · Apr 26, 2022 · US
Measuring method and measuring device
US-2021249287-A1 · Aug 12, 2021 · US
Method And Structure for Low Density Silicon Oxide for Fusion Bonding and Debonding
US-2020343092-A1 · Oct 29, 2020 · US
Bonding system and bonding method
US-2020294824-A1 · Sep 17, 2020 · US
Bonding systems
US-10340248-B2 · Jul 2, 2019 · US
Bonding System
US-2018019225-A1 · Jan 18, 2018 · US
Bonding method, storage medium, bonding apparatus and bonding system
US-9741595-B2 · Aug 22, 2017 · US
Coating apparatus
US-9401291-B2 · Jul 26, 2016 · US
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
US-2016155721-A1 · Jun 2, 2016 · US
Coating apparatus
US-2015128858-A1 · May 14, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 27 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0428 | 18 |
| H10P10/128 | 15 |
| H01L21/67092 | 10 |
| H01L24/80 | 9 |
| H10P72/53 | 8 |