Solder alloy, solder ball, and solder joint

Patent metadata

Field	Value
Publication number	US-10500680-B2
Application number	US-201715780543-A
Country	US
Kind code	B2
Filing date	Sep 12, 2017
Priority date	Sep 13, 2016
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1% or more and less than 2.0%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.20%, Ge: 0.006 to 0.09%, and Co: 0.003% or more and less than 0.05%, and optionally Fe: 0.005 to 0.015% and P: 0.1% or less, with the balance being Sn.

First claim

The invention claimed is:

1. A solder alloy consisting of, in mass %:
Bi: 0.1% or more and less than 2.0%;
Cu: 0.1 to 1.0%;
Ni: 0.01 to 0.20%;
Ge: 0.006 to 0.09%;
Co: 0.003% or more and less than 0.05%;
P: 0.1% or less; and
optionally Fe: 0.005 to 0.15%, with the balance being Sn, wherein
the alloy composition satisfies the following relation (1) and relation (2):
72×10 −6 ≤Ge/Sn≤920×10 −6   (1)

0.027≤(Bi×Ge)/(Cu×Ni)≤2.4  (2)

where in the relation (1) and the relation (2), Bi, Ge, Cu, Ni and Sn each represents a content (mass %) in the solder alloy.

2. The solder alloy according to claim 1 , wherein P is 0 mass %.

3. A solder alloy consisting of, in mass %:
Bi: 0.1% or more and less than 2.0%;
Cu: 0.1 to 1.0%;
Ni: 0.01 to 0.20%;
Ge: 0.006 to 0.09%; and
optionally P: 0.1% or less, with the balance being Sn, wherein
the alloy composition satisfies the following relation (1) and relation (2):
72×10 −6 ≤Ge/Sn≤920×10 −6   (1)

0.027≤(Bi×Ge)/(Cu×Ni)≤2.4  (2)

where in the relation (1) and the relation (2), Bi, Ge, Cu, Ni and Sn each represents a content (mass %) in the solder alloy.

4. The solder alloy according to claim 1 , wherein Fe is 0% and P is 0.1% or less.

5. The solder alloy according to claim 1 , which is for use in an electronic device including a joint through which a current is caused to flow at a current density of 5 kA/cm 2 to 100 kA/cm 2 .

6. A solder ball consisting of the solder alloy according to claim 1 .

7. A solder joint comprising the solder alloy according to claim 1 .

8. The solder alloy according to claim 1 , wherein Fe is 0.005 to 0.015% in mass.

9. The solder alloy according to claim 3 , wherein P is 0.1% or less.

10. The solder alloy according to claim 3 , which is for use in an electronic device including a joint through which a current is caused to flow at a current density of 5 kA/cm 2 to 100 kA/cm 2 .

11. A solder ball consisting of the solder alloy according to claim 3 .

12. A solder joint comprising the solder alloy according to claim 3 .

13. The solder alloy according to claim 1 , wherein Bi is 0.1% or more and less than 1.9% in mass.

14. The solder alloy according to claim 1 , wherein Co is 0.003% or more and less than 0.047% in mass.

15. The solder alloy according to claim 3 , wherein Bi is 0.1% or more and less than 1.9% in mass.

16. The solder alloy according to claim 1 , wherein
Bi is 0.1% or more and less than 1.9% in mass, and
Co is 0.003% or more and less than 0.047% in mass.

Assignees

• Senju Metal Industry Co

Inventors

• Tachibana Ken
• NOMURA Hikaru
• Iijima Yuki
• Saito Takashi
• Yokoyama Takahiro
• Yoshikawa Shunsaku
• Izumita Naoko

Classifications

• H05K3/3465

  Application of solder · CPC title

• H05K3/346

  Solder materials or compositions specially adapted therefor · CPC title

• C22C13/00

  Alloys based on tin · CPC title

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title

• C22C13/02

  with antimony or bismuth as the next major constituent · CPC title