Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
Lead-free solder ball
US9700963B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9700963-B2 |
| Application number | US-201615196227-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 29, 2016 |
| Priority date | Mar 28, 2011 |
| Publication date | Jul 11, 2017 |
| Grant date | Jul 11, 2017 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The solder ball has a solder composition that includes 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. In the process, the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board.
First claim
Opening claim text (preview).
The invention claimed is: 1. A process for mounting a BGA or CSP on a printed circuit board, the process comprising: melting and fusing together solder paste and a solder ball which has a solder composition comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn, wherein the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board. 2. The process according to claim 1 , wherein the solder composition comprises 0.9-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. 3. The process according to claim 1 , wherein the solder composition comprises 1.0 mass % of Ag, 0.75 mass % of Cu, 0.07 mass % of Ni, and a remainder of Sn. 4. The process according to claim 1 , wherein the solder composition further comprises at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass %. 5. The process according to claim 1 , wherein the solder composition further comprises at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %. 6. The process according to claim 1 , wherein the solder ball has a diameter of at least 0.1 mm. 7. The process according to claim 1 , wherein the solder ball has a diameter of at least 0.3 mm. 8. The process according to claim 1 , wherein the solder ball has a diameter of at least 0.5 mm. 9. The process according to claim 1 , wherein the solder composition consists of 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, optionally at least one element selected from Fe, Co, Pt, Bi, In, Sb, P, and Ge, and a remainder of Sn. 10. The process according to claim 1 , wherein the solder composition consists of 0.9-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, optionally at least one element selected from Fe, Co, Pt, Bi, In, Sb, P, and Ge, and a remainder of Sn. 11. The process according to claim 1 , wherein the solder composition consists of 1.0 mass % of Ag, 0.75 mass % of Cu, 0.07 mass % of Ni, optionally at least one element selected from Fe, Co, Pt, Bi, In, Sb, P, and Ge, and a remainder of Sn. 12. A method of forming a solder bump on a module substrate having electrodes selected from electroplated Ni/Au electrodes, electroless Ni/Pd/Au electrodes, and Cu—OSP electrodes using a lead-free solder ball wherein the lead-free solder ball is used for electrodes by mounting on a module substrate for a BGA or CSP and which has a solder composition comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. 13. The method according to claim 12 , wherein the solder composition consists of 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, optionally at least one element selected from Fe, Co, Pt, Bi, In, Sb, P, and Ge, and a remainder of Sn. 14. The method according to claim 12 , wherein the solder composition consists of 0.9-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, optionally at least one element selected from Fe, Co, Pt, Bi, In, Sb, P, and Ge, and a remainder of Sn.
Assignees
Inventors
Classifications
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
Bond pads specially adapted therefor · CPC title
comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title
Structures or relative sizes · CPC title
in solid form, e.g. by using a powder or by stud bumping · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9700963B2 cover?
- Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The solder ball has a solder composition that includes 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. In the process, the solder ball is placed on an electrod…
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/0244. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 11 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).