Flux and solder paste
US-2024278360-A1 · Aug 22, 2024 · US
Lead-free solder, lead-free solder ball, solder joint using the lead-free solder and semiconductor circuit having the solder joint
US10434608B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10434608-B2 |
| Application number | US-201414916730-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 21, 2014 |
| Priority date | Sep 11, 2013 |
| Publication date | Oct 8, 2019 |
| Grant date | Oct 8, 2019 |
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- Title
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Abstract
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Lead-free solder is characterized in that the lead-free solder contains Ag of 1.2 mass % through 4.5 mass %, Cu of 0.25 mass % through 0.75 mass %, Bi of 1 mass % through 5.8 mass %, Ni of 0.01 mass % through 0.15 mass % and Sn as the remainder. These addition amounts allow to be further improved the common solder properties such as wettability, shear strength properties and the like, in addition to the thermal fatigue resistance.
First claim
Opening claim text (preview).
The invention claimed is: 1. A lead-free solder comprising Ag of 2.0 mass % through 4.5 mass %; Cu of 0.25 mass % through 0.75 mass %; Bi of 3.0 mass % through 5.8 mass %; Ni of 0.01 mass % through 0.03 mass % and Sn as the remainder. 2. The lead-free solder according to claim 1 comprising Ag of 2 mass % through 4 mass %; Cu of 0.3 mass % through 0.75 mass %; Bi of 3.0 mass % through 5 mass %; Ni of 0.02 mass % through 0.03 mass % and Sn as the remainder. 3. The lead-free solder according to claim 1 comprising Ag of 2.5 mass % through 3.5 mass %; Cu of 0.5 mass % through 0.75 mass %; Bi of 3 mass % through 5 mass %; Ni of 0.03 mass % and Sn as the remainder. 4. The lead-free solder of claim 1 , wherein a total amount of 0.0005 mass % through 0.05 mass % of at least one selected from the group consisting of P and Ge is added to the lead-free solder. 5. A lead-free solder ball comprising Ag of 2.0 mass % through 4.5 mass %; Cu of 0.25 mass % through 0.75 mass %; Bi of 3.0 mass % through 5.8 mass %; Ni of 0.01 mass % through 0.03 mass % and Sn as the remainder. 6. The lead-free solder ball according to claim 5 comprising Ag of 2 mass % through 4 mass %; Cu of 0.3 mass % through 0.75 mass %; Bi of 3.0 mass % through 5 mass %; Ni of 0.02 mass % through 0.03 mass % and Sn as the remainder. 7. The lead-free solder ball according to claim 5 comprising Ag of 2.5 mass % through 3.5 mass %; Cu of 0.5 mass % through 0.75 mass %; Bi of 3 mass % through 5 mass %; Ni of 0.03 mass % and Sn as the remainder. 8. The lead-free solder ball according to claim 5 , wherein a total amount of 0.0005 mass % through 0.05 mass % of at least one selected from the group consisting of P and Ge is added to the lead-free solder. 9. A solder joint, wherein lead-free solder comprising Ag of 2.0 mass % through 4.5 mass %; Cu of 0.25 mass % through 0.75 mass %; Bi of 3.0 mass % through 5.8 mass %; Ni of 0.01 mass % through 0.03 mass % and Sn as the remainder is used. 10. The solder joint according to claim 9 , wherein the lead-free solder comprises Ag of 2 mass % through 4 mass %; Cu of 0.3 mass % through 0.75 mass %; Bi of 3.0 mass % through 5 mass %; Ni of 0.02 mass % through 0.03 mass % and Sn as the remainder. 11. The solder joint according to claim 9 , wherein the lead-free solder comprises Ag of 2.5 mass % through 3.5 mass %; Cu of 0.5 mass % through 0.75 mass %; Bi of 3 mass % through 5 mass %; Ni of 0.03 mass % and Sn as the remainder. 12. The solder joint according to claim 9 , wherein a total amount of 0.0005 mass % through 0.05 mass % of at least one selected from the group consisting of P and Ge is added to the lead-free solder. 13. A semiconductor circuit, wherein lead-free solder comprising Ag of 2.0 mass % through 4.5 mass %; Cu of 0.25 mass % through 0.75 mass %; Bi of 3.0 mass % through 5.8 mass %; Ni of 0.01 mass % through 0.03 mass % and Sn as the remainder is used. 14. The semiconductor circuit according to claim 13 , wherein the lead-free solder comprises Ag of 2 mass % through 4 mass %; Cu of 0.3 mass % through 0.75 mass %; Bi of 3.0 mass % through 5 mass %; Ni of 0.02 mass % through 0.03 mass % and Sn as the remainder. 15. The semiconductor circuit according to claim 13 , wherein the lead-free solder comprises Ag of 2.5 mass % through 3.5 mass %; Cu of 0.5 mass % through 0.75 mass %; Bi of 3 mass % through 5 mass %; Ni of 0.03 mass % and Sn as the remainder. 16. The semiconductor circuit according to claim 13 , wherein a total amount of 0.0005 mass % through 0.05 mass % of at least one selected from the group consisting of P and Ge is added to the lead-free solder.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
characterised by the relative positions of pads or connectors relative to package parts · CPC title
comprising gold [Au] · CPC title
comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title
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- What does patent US10434608B2 cover?
- Lead-free solder is characterized in that the lead-free solder contains Ag of 1.2 mass % through 4.5 mass %, Cu of 0.25 mass % through 0.75 mass %, Bi of 1 mass % through 5.8 mass %, Ni of 0.01 mass % through 0.15 mass % and Sn as the remainder. These addition amounts allow to be further improved the common solder properties such as wettability, shear strength properties and the like, in additi…
- Who is the assignee on this patent?
- Senju Metal Industry Co, Senju Metal Indsutry Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 08 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).