Core material, electronic component and method for forming bump electrode

Patent metadata

Field	Value
Publication number	US-11495566-B2
Application number	US-202117472032-A
Country	US
Kind code	B2
Filing date	Sep 10, 2021
Priority date	Sep 10, 2020
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

A core material has a core; a solder layer provided outside the core and being a solder alloy containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and a Sn layer provided outside the solder layer. The solder layer has a thickness of 1 μm or more on one side. The Sn layer has a thickness of 0.1 μm or more on one side. A thickness of the Sn layer is 0.215% or more and 36% or less of the thickness of the solder layer.

First claim

What is claimed is:

1. A core material comprising:
a core;
a solder layer provided outside the core and being a solder alloy containing only Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and
a Sn plating layer provided outside the solder layer,
wherein
the solder layer has a thickness of 1 μm or more on one side,
the Sn plating layer has a thickness of 0.1 μm or more on one side, and
a thickness of the Sn plating layer is 0.215% or more and 36% or less of the thickness of the solder layer.

2. The core material according to claim 1 , wherein the solder layer is a (Sn-Ag-Cu)-based solder.

3. The core material according to claim 1 , further comprising a base plating layer made of any one of Ni, Co, Ni—Co, Ni—P and Ni—B between the core and the solder layer.

4. The core material according to claim 1 , wherein Cu ball or Cu column is used as the core.

5. An electronic component using the core material according to claim 1 as a solder bump.

6. A method for forming bump electrode comprising steps of:
mounting the core material according to claim 1 on an electrode;
forming a bump electrode by heating the mounted core material.

7. The core material according to claim 1 , wherein the Sn plating layer is an outermost layer.

Assignees

• Senju Metal Industry Co

Inventors

• KONDOH Shigeki
• Tsuchiya Masato
• Iwamoto Hiroyuki
• Okada Hiroshi
• Souma Daisuke

Classifications

• H10W72/01257

  by reflowing · CPC title

• H10W72/255

  of outermost layers of multilayered bumps, e.g. material of a coating · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/223

  characterised by the structure of the outermost layers, e.g. multilayered coatings · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title