Core material, electronic component and method for forming bump electrode
US-2024100635-A1 · Mar 28, 2024 · US
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Souma Daisuke patents
Souma Daisuke is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Souma Daisuke |
| Total patents | 7 |
| First publication | Dec 16, 2021 |
| Latest publication | Mar 28, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Core material, electronic component and method for forming bump electrode
US-11872656-B2 · Jan 16, 2024 · US
Core material, electronic component and method for forming bump electrode
US-11495566-B2 · Nov 8, 2022 · US
Method for forming bump electrode substrate
US-11478869-B2 · Oct 25, 2022 · US
Core material, electronic component and method for forming bump electrode
US-2022212294-A1 · Jul 7, 2022 · US
Core material, electronic component and method for forming bump electrode
US-2022077093-A1 · Mar 10, 2022 · US
Method for forming bump electrode substrate
US-2021387276-A1 · Dec 16, 2021 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Senju Metal Industry Co | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/20 | 5 |
| B23K35/262 | 5 |
| B23K35/0244 | 5 |
| H05K3/3478 | 5 |
| H05K3/3436 | 5 |