Core material, electronic component and method for forming bump electrode
US-11495566-B2 · Nov 8, 2022 · US
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Patent family 76464591
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 76464591 |
| Family type | — |
| Earliest priority | Sep 10, 2020 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11495566B2 — Core material, electronic component and method for forming bump electrode |
Representative publication
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US11495566B2 — Core material, electronic component and method for forming bump electrode (published Nov 8, 2022)
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