Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste

Patent metadata

Field	Value
Publication number	US-11164804-B2
Application number	US-201916519277-A
Country	US
Kind code	B2
Filing date	Jul 23, 2019
Priority date	Jul 23, 2019
Publication date	Nov 2, 2021
Grant date	Nov 2, 2021

Abstract

An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.

First claim

What is claimed is:

1. A method of fabricating an integrated circuit (IC) device carrier package comprising:
aligning a lid-ridge with an IC device carrier, the lid-ridge consisting of a metal bar, a plurality of upper contacts formed upon an upper surface of the metal bar, and a plurality of lower contacts formed upon a lower surface of the metal bar;
connecting a lower contact of the lid-ridge to a pad of an IC device carrier with a first nano particle metallic paste, wherein the lower contact of the lid-ridge is one of the plurality of lower contacts formed upon the lower surface of the metal bar;
sintering the first nano particle metallic paste to form a first metallic connection between the lower contact and the first pad;
subsequent to sintering the first nano particle metallic paste, attaching an IC device to the IC device carrier with solder interconnects;
forming a contiguous underfill material instance between the IC device and the IC device carrier and between the metal bar of the lid-ridge and the IC device carrier;
applying a thermal interface material to the IC device upper surface;
applying a second nano particle metallic paste to the underside of a lid;
attaching the lid to the lid-ridge by connecting an upper contact of the lid-ridge to the underside of the lid with the second nano particle metallic paste, wherein the upper contact of the lid-ridge is one of the plurality of upper contacts formed upon the upper surface of the metal bar; and
curing the thermal interface material and sintering the second nano particle metallic paste to form a second metallic connection between the upper contact and the lid.

2. The method of claim 1 , further comprising:
applying a seal band material to the IC device carrier around the perimeter of the IC device and the lid-ridge.

3. The method of claim 2 , further comprising:
attaching the lid to the IC device carrier with the seal band material.

4. The method of claim 2 , further comprising:
attaching the lid to the IC device with the thermal interface material.

5. The method of claim 1 , wherein the pad of the IC device carrier provides a ground potential.

6. The method of claim 5 , wherein the pad of the IC device carrier grounds the lid-ridge and grounds the lid.

Assignees

• IBM

Inventors

• Arvin Charles L
• Drummond Kevin
• Del Carro Luca
• Brunschwiler Thomas
• Allard Stephanie
• Marston Kenneth C
• Interrante Marcus E

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W76/157

  having interconnections parallel to the insulating or insulated base · CPC title

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title

• H10W74/137

  the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence) · CPC title