Die tray with channels

Patent metadata

Field	Value
Publication number	US-10796936-B2
Application number	US-201715806822-A
Country	US
Kind code	B2
Filing date	Nov 8, 2017
Priority date	Dec 22, 2016
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

Representative implementations of devices and techniques provide a device and a technique for processing integrated circuit (IC) dies. The device comprises a die tray (such as a pick and place tray, for example) for holding the dies during processing. The die tray may include an array of pockets sized to hold individual dies. The technique can include loading dies on the die tray, cleaning the top and bottom surfaces of the dies, and ashing and activating both surfaces of the dies while on the die tray, eliminating the need to turn the dies over during processing.

First claim

What is claimed is:

1. An apparatus, comprising:
a substantially planar tray;
an array of support posts disposed at a surface of the tray, each post configured to elevate an element off the surface of the tray, the element having a substantially planar shape with a plurality of vertices;
a quantity of retaining posts equal to the number of element vertices disposed on a surface of the tray, each retaining post positioned at a first side of each vertex of the element and arranged to laterally restrain the element loaded onto the support posts;
a quantity of mount posts equal to the number of element vertices disposed on a surface of the tray, each mount post positioned at a second side of each vertex of the element, paired with each retaining post and arranged to longitudinally restrain the element loaded onto the support posts, the retaining posts and the mount posts trapping each vertex of the element; and
one or more channels under the said element arranged to direct fluids away from the element.

2. The apparatus of claim 1 , wherein one or more of the support posts of the array of support posts includes at least a portion with a contoured or elliptical surface.

3. An apparatus, comprising:
a tray;
an array of support posts disposed on a surface of the tray, the support posts configured to support and elevate an element off the surface of the tray, the array of support posts comprising a first set of supporting posts and a second set of supporting posts, the first set of supporting posts arranged to support the element at a different height with respect to the tray surface than the second set of supporting posts;
a plurality of lateral restraining posts coupled to the support posts and arranged to laterally restrain the element loaded onto the support posts; and
a plurality of longitudinal restraining posts coupled to support posts and arranged to longitudinally restrain the element loaded onto the support posts.

4. The apparatus of claim 3 , further comprising one or more channels under the element arranged to direct fluids away from the element.

5. The apparatus of claim 3 , wherein at least a portion of one or more of the support posts includes an elliptical surface.

6. The apparatus of claim 3 , wherein a portion of one or more of the support posts includes an opening arranged to move fluids away from a surface of the element.

7. The apparatus of claim 3 , wherein one or more of the support posts comprises a first portion comprising a lateral restraining post and/or a longitudinal restraining post, whereby the element is restrained from moving in an x or y direction, respectively, by the first portion and a second portion comprising an element mounting post, whereby the element rests on the second portion, elevated from the surface of the tray in a z direction.

8. The apparatus of claim 7 , wherein the first portion is disposed above the second portion in the z direction on the one or more of the support posts.

9. The apparatus of claim 7 , wherein for each element supported, the tray includes at least four support posts, with each support post disposed at a different vertex of the element and with each support post including one lateral restraining post and one longitudinal restraining post positioned on either side of the vertex.

10. The apparatus of claim 3 , further comprising a clearance gap disposed between the element and at least one of the lateral or longitudinal restraining support posts.

Assignees

• Invensas Bonding Tech Inc

Inventors

• Uzoh Cyprian Emeka

Classifications

• H10W90/00

  Package configurations · CPC title

• H10P72/16

  Trays for chips · CPC title

• H10P70/30

  Cleaning after the substrates have been singulated · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07311

  Treating the bonding area before connecting, e.g. by applying flux or cleaning · CPC title