Chip plcaing apparatus, processing system and processing method
US-2026101719-A1 · Apr 9, 2026 · US
characterised by a material, a roughness, a coating or the like
characterised by a material, a roughness, a coating or the like · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/165 |
| Official title | {characterised by a material, a roughness, a coating or the like} |
| Display label | characterised by a material, a roughness, a coating or the like |
| Total patents | 50 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 6 |
| 2018 | 3 |
| 2019 | 5 |
| 2020 | 5 |
| 2021 | 6 |
| 2022 | 4 |
| 2023 | 8 |
| 2024 | 4 |
| 2025 | 3 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge
US-12588463-B2 · Mar 24, 2026 · US
Polyimide precursor composition, polyimide film formed from the same and method of manufacturing semiconductor device using the same
US-12570801-B2 · Mar 10, 2026 · US
Methods for reducing defects during die placement
US-2026018444-A1 · Jan 15, 2026 · US
Carrier plate and transferring device
US-12381100-B2 · Aug 5, 2025 · US
Method for fabricating silicon chip carriers using wet bulk micromachining for ir detector applications
US-2025210388-A1 · Jun 26, 2025 · US
Package trays for semiconductor packages and related methods
US-2025112069-A1 · Apr 3, 2025 · US
Transfer substrate and method of manufacturing electronic apparatus
US-2024395587-A1 · Nov 28, 2024 · US
Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge
US-2024355655-A1 · Oct 24, 2024 · US
Grid structure for fixing specimen
US-2024242989-A1 · Jul 18, 2024 · US
Carrier plate and transferring device
US-2024047250-A1 · Feb 8, 2024 · US
Electronic component transfer by levitation
US-2023402302-A1 · Dec 14, 2023 · US
Under boat support with electrostatic discharge structure
US-2023386875-A1 · Nov 30, 2023 · US
Singulated die shipping tray assembly
US-2023290661-A1 · Sep 14, 2023 · US
Polyimide precursor composition, polyimide film formed from the same and method of manufacturing semiconductor device using the same
US-2023279183-A1 · Sep 7, 2023 · US
Substrate heating apparatus and substrate processing apparatus
US-2023282496-A1 · Sep 7, 2023 · US
Method for making adsorption device
US-11676839-B2 · Jun 13, 2023 · US
Adsorption device, transferring system having same, and transferring method using same
US-11676840-B2 · Jun 13, 2023 · US
Substrate for manufacturing display device and manufacturing method therefor
US-2023079059-A1 · Mar 16, 2023 · US
Adsorption device, transferring system having same, and transferring method using same
US-11521878-B2 · Dec 6, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/165?
- CPC H10P72/165 is the Cooperative Patent Classification code for “characterised by a material, a roughness, a coating or the like.”
- How many patents are filed under CPC H10P72/165 (characterised by a material, a roughness, a coating or the like)?
- Our database includes 50 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/165 growing?
- Publication counts under this code: 4 in 2024 vs 3 in 2025 (latest complete years).