Method and apparatus for deposition cleaning in a pumping line

Patent metadata

Field	Value
Publication number	US-11024489-B2
Application number	US-201916679640-A
Country	US
Kind code	B2
Filing date	Nov 11, 2019
Priority date	Jan 13, 2016
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

A method is provided for cleaning a pumping line having a plurality of inline plasma sources coupled thereto. The method includes supplying a cleaning gas to the pumping line from a wafer processing chamber connected to the pumping line. The method also includes generating a localized plasma at one or more of the plurality of inline plasma sources using the cleaning gas flowing in the pumping line. Each localized plasma is adapted to clean at least a portion of the pumping line. The method further includes determining one or more impedances of the localized plasma at the one or more inline plasma sources and monitoring the one or more impendences to detect an endpoint of the cleaning.

First claim

What is claimed is:

1. A method for cleaning a pumping line having a plurality of inline plasma sources coupled thereto, the method comprising;
supplying a cleaning gas to the pumping line from a wafer processing chamber connected to the pumping line;
generating a localized plasma at one or more of the plurality of inline plasma sources using the cleaning gas flowing in the pumping line, wherein each localized plasma is adapted to clean at least a portion of the pumping line;
determining one or more impedances of the localized plasma at the one or more inline plasma sources; and
monitoring the one or more impendences to detect an endpoint of the cleaning.

2. The method of claim 1 , wherein at least one of the plurality of inline plasma sources is upstream from a throttle valve of the pumping line.

3. The method of claim 1 , wherein detecting an endpoint of the cleaning comprises determining a steady state of at least one of the monitored impedances.

4. The method of claim 1 , further comprising stopping the supply of the cleaning gas to the pumping line after detecting the endpoint.

5. The method of claim 1 , further comprising turning off the localized plasma at the one or more inline plasma sources after detecting the endpoint.

6. The method of claim 1 , further comprising:
monitoring at least one of a corresponding voltage or a corresponding current of each localized plasma; and
determining the one or more impedances based on the corresponding voltage or corresponding current.

7. The method of claim 1 , wherein an inline plasma source is spaced about 2 meters to about 3 meters from an adjacent plasma source.

8. The method of claim 1 , further comprising forming the localized plasma on an interior surface of each inline plasma source, wherein the interior surface of each inline plasma source defines a generally cylindrical interior volume that forms a section of the pumping line.

9. The method of claim 8 , wherein a conductance is substantially constant along the pumping line and the generally cylindrical interior volumes of the inline plasma sources.

10. The method claim 5 , further comprising injecting a second cleaning gas into an interior volume of at least one of the inline plasma sources via a port of the at least one inline plasma source.

11. The method of claim 10 , further comprising directing the second cleaning gas in a distributed flow pattern or an annular flow pattern along a wall of the pumping line.

Assignees

• Mks Instr Inc

Inventors

• Hill Gordon
• Benedict Scott
• Wenzel Kevin

Classifications

• H01J37/32963

  End-point detection · CPC title

• H01J37/32568

  Relative arrangement or disposition of electrodes; moving means · CPC title

• H01J37/32844

  Treating effluent gases · CPC title

• H01J37/32348

  Dielectric barrier discharge · CPC title

• H01J37/32862 Primary

  In situ cleaning of vessels and/or internal parts · CPC title