Cleaning formulation for removing residues on surfaces

Patent metadata

Field	Value
Publication number	US-10927329-B2
Application number	US-201916361637-A
Country	US
Kind code	B2
Filing date	Mar 22, 2019
Priority date	Dec 6, 2013
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one second chelating agent different from the first chelating agent, the second chelating agent containing at least two nitrogen-containing groups; 4) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 5) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 6) water; and 7) optionally, at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

First claim

What is claimed is:

1. A cleaning composition, comprising:
1) hydroxylamine;
2) an alkanolamine in an amount of at most about 3% by weight of the composition;
3) an alkylene glycol; and
4) water
wherein the pH of the composition is from about 7 to about 11.

2. The composition of claim 1 , wherein the pH of the composition is about 11.

3. The composition of claim 1 , wherein the hydroxylamine is in an amount of from about 0.5% to about 20% by weight of the composition.

4. The composition of claim 1 , wherein the hydroxylamine is in an amount of from about 1% to about 10% by weight of the composition.

5. The composition of claim 1 , wherein the alkanolamine is in an amount of at most about 2.5 by weight of the composition.

6. The composition of claim 1 , wherein the alkanolamine is in an amount of at most about 1.5% by weight of the composition.

7. The composition of claim 1 , wherein the alkanolamine is in an amount of at least about 0.1% by weight of the composition.

8. The composition of claim 1 , wherein the alkylene glycol is ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, or tetraethylene glycol.

9. The composition of claim 1 , wherein the alkylene glycol is in an amount of at least about 10% by weight of the composition.

10. The composition of claim 1 , wherein the alkylene glycol is in an amount of at most about 30% by weight of the composition.

11. The composition of claim 1 , wherein the water is in an amount of at most about 90% by weight of the composition.

12. The composition of claim 1 , wherein the water is in an amount of at least about 78% by weight of the composition.

13. The composition of claim 1 , further comprising an additive.

14. The composition of claim 1 , further comprising a surfactant.

15. The composition of claim 1 , wherein the composition is free of a metal halide of the formula W z MX y , in which W is selected from H, an alkali or alkaline earth metal, and a metal-ion-free hydroxide base moiety; M is a metal selected from the group consisting of Si, Ge, Sn, Pt, P, B, Au, Ir, Os, Cr, Ti, Zr, Rh, Ru and Sb; y is from 4 to 6; and z is 1, 2, or 3.

Assignees

• Fujifilm Electronic Mat Usa Inc

Inventors

• Takahashi Tomonori
• Du Bing
• Wojtczak William A
• Dory Thomas
• Kneer Emil A

Classifications

• H10P76/204

  of organic photoresist masks · CPC title

• H10P70/273

  the processing being a delineation of conductive layers, e.g. by RIE · CPC title

• H10P70/234

  the processing being the formation of vias or contact holes · CPC title

• H10P70/27

  during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title

• H10P50/287

  by chemical means · CPC title