Method for releasing resin film and method for manufacturing organic EL display device

Patent metadata

Field	Value
Publication number	US-10847758-B2
Application number	US-201616067223-A
Country	US
Kind code	B2
Filing date	Jul 22, 2016
Priority date	Dec 29, 2015
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

A resin film is released from a supporting substrate without using light irradiation, with ease, and without damaging the resin film or the like. Preparation for separating the supporting substrate on which the resin film is cohesively formed into a first part and a second part; and at least one of the first part and the second part is allowed or caused to move in a direction parallel to an one surface of the first part while the first part of the supporting substrate and at least an edge of the second part facing the first part being moved with respect to one another, while a close contact between the resin film and an one surface of the second part of the supporting substrate being maintained, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part.

First claim

What is claimed is:

1. A method for releasing a resin film cohesively formed on an one surface of a supporting substrate from the supporting substrate, the method comprising:
forming the resin film by baking a liquid resin applied onto the supporting substrate;
preparing to separate the supporting substrate into a first part and a second part; and
allowing or causing at least one of the first part and the second part to move in a direction parallel to an one surface of the first part while moving the first part of the supporting substrate and at least an edge of the second part facing the first part with respect to one another, while maintaining a close contact between the resin film and an one surface of the second part, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part;
wherein the supporting substrate is made of a metal plate or a semiconductor substrate, the first part and the second part are removably connected to each other, and preparing to separate the supporting substrate is carried out by making the first part and the second part separable from each other;
wherein a separation between the first part and the edge of the second part along the perpendicular direction is performed by moving the edge of the second part and the one surface of the first part in the perpendicular direction;
wherein moving at least one of the first part and the second part in the direction parallel to the one surface of the first part corresponds to moving in a direction in which the first part and the second part overlap in a plan view;
wherein at least one of the first part and the second part is caused to move a distance of d*tan(θ/2) in the direction parallel to the one surface of the first part for every distance of separation d in the perpendicular direction, provided that the θ is an angle between the resin film and the one surface of the first part, while the resin film tensing between a part of the resin film closely contacted with the first part and the edge of the second part, when the first part and the edge of the second part are separated along the perpendicular direction.

2. A method for manufacturing an organic EL display device comprising forming an organic EL element on a flexible substrate, the method comprising:
forming the flexible substrate by baking a liquid resin applied onto a supporting substrate;
forming the organic EL element in a matrix form on the flexible substrate, the organic EL element comprising TFT;
forming a sealing member for sealing the organic EL element;
preparing to separate the supporting substrate between a first part and a second part other than the first part, the first part including a part with the sealing member formed thereon; and
a step of allowing or causing at least one of the first part and the second part to move in a direction parallel to an one surface of the first part while moving the first part of the supporting substrate and at least an edge of the second part facing the first part with respect to one another, while maintaining a close contact between the flexible substrate and an one surface of the second part of the supporting substrate, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part.

3. A method for releasing a resin film cohesively formed on an one surface of a supporting substrate from the supporting substrate, the method comprising:
forming the resin film by baking a liquid resin applied onto the supporting substrate;
preparing to separate the supporting substrate into a first part and a second part, wherein the first part and the second part are removably connected to each other, the resin film covers both the first part and the second part; and
moving at least one of the first part and the second part in a direction parallel to the one surface of the first part while moving the first part and the second part with respect to one another in a direction perpendicular to the one surface of the first part to separate the first part from the second part, while maintaining a close contact between the resin film and the second part, such that the first part and the second part are separated from each other and the resin film is peeled from the first part.

4. The method for releasing the resin film according to claim 3 , wherein preparing to separate the supporting substrate into the first part and the second part comprises forming a scribe line to a boundary between the first part and the second part and cutting the supporting substrate along the scribe line.

Assignees

• Hon Hai Prec Ind Co Ltd

Inventors

• Kishimoto Katsuhiko
• Tanaka Kohichi

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10K59/873

  Encapsulations · CPC title

• B65H29/56 Primary

  for stripping from elements or machines {(for electrographic machines G03G)} · CPC title

• H10D86/411

  characterised by materials, geometry or structure of the substrates · CPC title