Peeling apparatus

Patent metadata

Field	Value
Publication number	US-9676175-B2
Application number	US-201514740957-A
Country	US
Kind code	B2
Filing date	Jun 16, 2015
Priority date	Jun 20, 2014
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

A peeling apparatus including a support body supply unit, a support body hold unit, a transfer mechanism, and a first structure body. The first structure body has a convex surface. The support body supply unit has a function of unwinding a first support body and includes one of a pair of tension applying mechanisms. The support body hold unit includes the other of the pair of tension applying mechanisms. The pair of tension applying mechanisms applies tension to the first support body. The transfer mechanism has a function of transferring a process member. The first structure body has a function of bending back the first support body along the convex surface. The first structure body has a function of dividing the process member into a first member and a second member. An angle at which the first structure body bends back the first support body is an obtuse angle.

First claim

What is claimed is:

1. A peeling apparatus configured to divide a process member into a first member and a second member, the peeling apparatus comprising:
a support body supply unit;
a support body hold unit;
a transfer mechanism;
a first structure body; and
a fixing mechanism,
wherein the first structure body comprises a convex surface,
wherein the support body supply unit is configured to unwind a first support body in rolled sheet form,
wherein the support body supply unit comprises one of a pair of tension applying mechanisms,
wherein the support body hold unit comprises the other of the pair of tension applying mechanisms,
wherein the pair of tension applying mechanisms is configured to apply a tension to the first support body,
wherein the transfer mechanism is configured to transfer the process member,
wherein the first structure body is positioned between the support body supply unit and the support body hold unit,
wherein the first structure body is configured to bend back the unwound first support body along the convex surface,
wherein the first structure body is configured to divide the process member into the first member and the second member,
wherein an angle at which the first structure body bends back the first support body is an obtuse angle, and
wherein the fixing mechanism is configured to fix the second member separated from the first member.

2. The peeling apparatus according to claim 1 , further comprising a second structure body,
wherein the second structure body comprises a convex surface,
wherein the second structure body is positioned between the first structure body and the support body hold unit,
wherein the second structure body is configured to deliver the first support body from the first structure body to the support body hold unit along the convex surface, and
wherein the second structure body is configured to apply a tension to the first support body.

3. The peeling apparatus according to claim 2 ,
wherein the convex surface of the first structure body has a larger radius of curvature than the convex surface of the second structure body.

4. The peeling apparatus according to claim 1 , further comprising a second structure body,
wherein the second structure body comprises a convex surface,
wherein the second structure body is positioned between the first structure body and the support body hold unit,
wherein the second structure body is configured to deliver the first support body from the first structure body to the support body hold unit along the convex surface, and
wherein the second structure body is configured to control the angle at which the first structure body bends back the first support body.

5. The peeling apparatus according to claim 4 ,
wherein the convex surface of the first structure body has a larger radius of curvature than the convex surface of the second structure body.

6. The peeling apparatus according to claim 1 , further comprising a liquid feeding mechanism,
wherein the liquid feeding mechanism is configured to supply liquid to a separation surface between the first member and the second member.

7. The peeling apparatus according to of claim 1 ,
wherein the convex surface of the first structure body has a radius of curvature of greater than or equal to 0.5 mm and less than or equal to 1000 mm.

8. The peeling apparatus according to claim 1 , further comprising a reel,
wherein the reel is positioned between the support body supply unit and the support body hold unit,
wherein a tape is bonded to one surface of the first support body, and
wherein the reel is configured to wind up the tape.

9. The peeling apparatus according to claim 1 , further comprising a pressure application mechanism,
wherein the pressure application mechanism is positioned between the support body supply unit and the first structure body, and
wherein the pressure application mechanism is configured to bond the process member and the first support body to each other.

10. A peeling apparatus configured to divide a process member into a first member and a second member, the peeling apparatus comprising:
a support body supply unit;
a first structure body; and
a fixing mechanism,
wherein the first structure body comprises a convex surface,
wherein the support body supply unit is configured to unwind a first support body in rolled sheet form,
wherein the first structure body is configured to divide the process member into the first member and the second member,
wherein an angle at which the first structure body bends back the first support body is an obtuse angle, and
wherein the fixing mechanism is configured to fix the second member separated from the first member.

11. The peeling apparatus according to claim 10 , further comprising
a second structure body, and
a support body hold unit,
wherein the second structure body comprises a convex surface,
wherein the first structure body is positioned between the support body supply unit and the support body hold unit,
wherein the second structure body is positioned between the first structure body and the support body hold unit,
wherein the second structure body is configured to deliver the first support body from the first structure body to the support body hold unit along the convex surface, and
wherein the second structure body is configured to apply a tension to the first support body.

12. The peeling apparatus according to claim 10 , further comprising
a second structure body, and
a support body hold unit,
wherein the second structure body comprises a convex surface,
wherein the first structure body is positioned between the support body supply unit and the support body hold unit,
wherein the second structure body is positioned between the first structure body and the support body hold unit,
wherein the second structure body is configured to deliver the first support body from the first structure body to the support body hold unit along the convex surface, and
wherein the second structure body is configured to control the angle at which the first structure body bends back the first support body.

13. The peeling apparatus according to claim 12 ,
wherein the convex surface of the first structure body has a larger radius of curvature than the convex surface of the second structure body.

14. The peeling apparatus according to claim 12 , further comprising a reel,
wherein the reel is positioned between the support body supply unit and the support body hold unit,
wherein a tape is bonded to one surface of the first support body, and
wherein the reel is configured to wind up the tape.

15. The peeling apparatus according to claim 10 , further comprising a liquid feeding mechanism,
wherein the liquid feeding mechanism is configured to supply liquid to a separation surface between the first member and the second member.

16. The peeling apparatus according to of claim 10 ,
wherein the convex surface of the first structure body has a radius of curvature of greater than or equal to 0.5 mm and less than or equal to 1000 mm.

17. The peeling apparatus according to claim 10 , further comprising a pressure application mechanism,
wherein the pressure application mechanism is positioned between the support body supply unit and the first structure body, and
wherein the pressure application mechanism is configured to bond the process member and the first support body to each other.

Assignees

• Semiconductor Energy Lab

Inventors

• Adachi Hiroki
• Eguchi Saki
• Ohno Masakatsu
• Yanaka Junpei
• Hirakata Yoshiharu

Classifications

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/7432

  used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate · CPC title

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title