Peeling method, semiconductor device, and peeling apparatus

Patent metadata

Field	Value
Publication number	US-9947568-B2
Application number	US-201414182834-A
Country	US
Kind code	B2
Filing date	Feb 18, 2014
Priority date	Feb 20, 2013
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.

First claim

The invention claimed is:

1. An apparatus comprising:
a first reel, a second reel, a first roller, a second roller, and a third roller;
a first holder configured to hold a substrate with a layer, and a second holder configured to hold the substrate;
an injector in the vicinity of the second roller, and
an ionizer between the first roller and the second roller,
wherein the first reel is configured to send a tape to the second reel sequentially through the first roller, the second roller, and the third roller,
wherein the injector is configured to inject liquid to a portion between the layer and the substrate,
wherein the second roller is configured to transfer the layer peeled from the substrate and attached to the tape,
wherein a diameter of the second roller is larger than a diameter of the first roller,
wherein the third roller is configured to change a direction to which the tape is sent,
wherein the substrate from which the layer is peeled is transferred to the second holder, and
wherein the first holder, the second holder, the first roller, and the second roller are arranged in a first direction.

2. The apparatus according to claim 1 , further comprising:
a unit configured to transfer the substrate from the first holder to the second holder.

3. The apparatus according to claim 1 , further comprising:
a first plate and a second plate, the first plate configured to support the tape between the third roller and the second reel,
wherein the second plate is positioned lower than the first plate.

4. The apparatus according to claim 1 , wherein an angle between the first direction and a second direction parallel to tangent lines of the second roller and the third roller is 45° or more and 60° or less.

5. The apparatus according to claim 1 , wherein the layer includes a light-emitting element.

6. An apparatus comprising:
a first reel, a second reel, a first roller, a second roller, and a third roller;
a first holder configured to hold a substrate with a layer, and a second holder configured to hold the substrate; and
an injector in the vicinity of the second roller,
wherein the first reel is configured to send a tape to the second reel sequentially through the first roller, the second roller, and the third roller,
wherein the injector is configured to inject liquid to a portion between the layer and the substrate,
wherein the second roller is configured to transfer the layer peeled from the substrate and attached to the tape,
wherein a diameter of the second roller is larger than a diameter of the first roller,
wherein the third roller is configured to control a tension of the tape,
wherein the third roller is configured to move up and down,
wherein the substrate from which the layer is peeled is transferred to the second holder, and
wherein the first holder, the second holder, the first roller, and the second roller are arranged in a first direction.

7. The apparatus according to claim 6 , further comprising:
an ionizer between the first roller and the second roller.

8. The apparatus according to claim 6 , further comprising:
a unit configured to transfer the substrate from the first holder to the second holder.

9. The apparatus according to claim 1 , wherein the liquid is water.

10. The apparatus according to claim 6 , wherein the liquid is water.

11. The apparatus according to claim 6 , wherein the layer includes a light-emitting element.

12. An apparatus comprising:
a first reel, a second reel, a first roller, and a second roller;
an injector in the vicinity of the first roller; and
a first holder configured to hold a glass substrate,
wherein the first reel is configured to send a tape to the second reel sequentially through the first roller and the second roller,
wherein the glass substrate with a layer is transferred to the first roller,
wherein the injector is configured to inject liquid to a portion between the layer and the glass substrate,
wherein the first roller is configured to transfer the layer peeled from the glass substrate and attached to the tape,
wherein the second roller is configured to control a tension of the tape,
wherein the second roller is configured to move up and down, and
wherein the glass substrate from which the layer is peeled is transferred to the first holder.

13. The apparatus according to claim 12 , wherein a diameter of the first roller is larger than a diameter of the second roller.

14. The apparatus according to claim 12 , wherein the liquid is water.

15. The apparatus according to claim 12 , wherein the first roller is configured to change a direction to which the tape is sent.

16. The apparatus according to claim 12 , further comprising:
a unit configured to transfer the glass substrate from a second holder to the first holder,
wherein the glass substrate is interposed between the first roller and the unit.

17. The apparatus according to claim 16 , wherein the first holder, the second holder, and the first roller are arranged in a first direction.

18. The apparatus according to claim 12 , wherein the layer includes a light-emitting element.

Assignees

• Semiconductor Energy Lab

Inventors

• Yasumoto Seiji
• Sato Masataka
• Eguchi Shingo
• Suzuki Kunihiko

Classifications

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/7432

  used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate · CPC title

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title