Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

Patent metadata

Field	Value
Publication number	US-10842058-B2
Application number	US-201414902198-A
Country	US
Kind code	B2
Filing date	Jun 30, 2014
Priority date	Jul 4, 2013
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 μm, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 μmol/dm2, and a total adhesion amount of the B element group is 40 to 900 μmol/dm2.

First claim

What is claimed is:

1. A metal foil for electromagnetic shielding, comprising:
a metal foil base having a thickness exceeding 4 μm, an alloy layer having an A element comprising Sn and a B element selected from the group consisting of Ag, Ni, Fe, Co and combinations thereof, formed on one or both surfaces of the metal foil base, and an underlayer comprising a B element selected from the group consisting of Ag, Ni, and Co, wherein the underlayer is formed between the alloy layer and the metal foil base, wherein
a total adhesion amount of the A element per surface is 10 to 300 μmol/dm 2 , and a total adhesion amount of the B element per surface is 40 to 900 μmol/dm 2 ,
and wherein an oxide layer having a thickness between 1 and 50 nm and comprising the A element is formed on the outermost surface of the alloy layer.

2. The metal foil for electromagnetic shielding according to claim 1 , wherein the alloy layer further includes a C element selected from the group consisting of P, W, and combinations thereof.

3. The metal foil for electromagnetic shielding according to claim 1 , wherein a total content of Cu, Al and Zn included in the alloy layer is 10 wt % or less.

4. The metal foil for electromagnetic shielding according to claim 1 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

5. The metal foil for electromagnetic shielding according to claim 1 , wherein the base is aluminum or an aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

6. An electromagnetic shielding material, comprising the metal foil for electromagnetic shielding according to claim 1 , and a resin layer laminated on one surface of the metal foil.

7. The electromagnetic shielding material according to claim 6 , wherein the resin layer is a resin film.

8. A shielding cable shielded by the electromagnetic shielding material according to claim 7 .

9. A shielding cable shielded by the electromagnetic shielding material according to claim 6 .

10. The metal foil for electromagnetic shielding according to claim 1 , wherein the alloy layer is an intermetallic compound.

11. The metal foil for electromagnetic shielding according to claim 10 , wherein the alloy layer further includes a C element selected from the group consisting of P, W, and combinations thereof.

12. The metal foil for electromagnetic shielding according to claim 11 , wherein a total content of the C element to the entire alloy layer is 40 wt % or less.

13. The metal foil for electromagnetic shielding according to claim 10 , wherein a total content of Cu, Al and Zn included in the alloy layer is 10 wt % or less.

14. The metal foil for electromagnetic shielding according to claim 10 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

15. The metal foil for electromagnetic shielding according to claim 10 , wherein the base is aluminum or an aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

16. The metal foil for electromagnetic shielding according to claim 2 , wherein a total content of the C element to the entire alloy layer is 40 wt % or less.

17. The metal foil for electromagnetic shielding according to claim 2 , wherein a total content of Cu, Al and Zn included in the alloy layer is 10 wt % or less.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Tanaka Koichiro

Classifications

• C25D5/10

  Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title

• Y10T428/12618

  Plural oxides · CPC title

• H05K9/0084

  comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition · CPC title

• Y10T428/12937

  Co- or Ni-base component next to Fe-base component · CPC title

• Y10T428/12896

  Ag-base component · CPC title