Metal foil for electromagnetic shielding, electromagnetic shielding material and shielded cable

Patent metadata

Field	Value
Publication number	US-10221487-B2
Application number	US-201415314808-A
Country	US
Kind code	B2
Filing date	May 30, 2014
Priority date	May 30, 2014
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

A metal foil for electromagnetic shielding 10 , comprising a base 1 consisting of a metal foil, an underlayer 2 including Ni formed on one or both surfaces of the base, and a Sn—Ni alloy layer 3 formed on a surface of the underlayer, wherein the Sn—Ni alloy layer includes 20 to 80 weight % of Sn, and when a total deposition amount of Sn is represented by T Sn [μg/dm 2 ], a percentage of Sn in the Sn—Ni alloy is represented by A Sn [weight %], a total deposition amount of Ni is represented by T Ni [μg/dm 2 ], and a percentage of Ni in the Sn—Ni alloy is represented by A Ni [weight %], T Sn : 500 to 91000 μg/dm 2 , T Ni : 2200 to 236000 μg/dm 2 , 170000=>{T Ni −T Sn ×(A Ni /A Sn )}=>1700.

First claim

What is claimed is:

1. A metal foil for electromagnetic shielding, comprising a base consisting of a metal foil, an underlayer including Ni formed on one or both surfaces of the base, and a Sn—Ni alloy layer including 2 weight % or less of constituent elements of the base to Sn—Ni formed on a surface of the underlayer, wherein a pure Sn layer is not present at the surface of the Sn—Ni alloy layer, when the surface of the Sn—Ni alloy layer is observed by SEM, the surface of the Sn—Ni alloy layer has no plurality of aciculate or columnar protrusions having an average diameter of 0.1 to 2.0 μm that is an average value of diameters of minimum circles surrounding convex parts of the respective protrusions, the Sn—Ni alloy layer includes 20 to 80 weight % of Sn, and when a total deposition amount of Sn is represented by T sn [μg/dm 2 ], the percentage of Sn in the Sn—Ni alloy is represented by A Sn [weight %], a total deposition amount of Ni is represented by T Ni [μg/dm 2 ], and the percentage of Ni in the Sn—Ni alloy is represented by A Ni [weight % ],T Sn : 500 to 91000 μg/dm 2 , T Ni : 2200 to 236000 μg/dm 2 , 170000 =>{T Ni −T sn ×(A Ni /A sn )}=>1700.

2. The metal foil for electromagnetic shielding according to any claim 1 , wherein the base is gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

3. The metal foil for electromagnetic shielding according to claim 1 , wherein the base is aluminum or an aluminum alloy, and a Zn layer is formed between the base and the underlayer.

4. An electromagnetic shielding material, comprising a resin layer laminated on one surface of the metal foil for electromagnetic shielding according to claim 1 .

5. The electromagnetic shielding material according to claim 4 , wherein the resin layer is a resin film.

6. A shielded cable shielded by the electromagnetic shielding material according to claim 4 .

7. A shielded cable shielded by the electromagnetic shielding material according to claim 5 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Tanaka Koichiro

Classifications

• C25D3/562

  containing more than 50% by weight of iron or nickel or cobalt · CPC title

• C23C18/54

  Contact plating, i.e. electroless electrochemical plating · CPC title

• H05K9/00

  Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) · CPC title

• C25D3/32

  characterised by the organic bath constituents used · CPC title

• C23C28/02

  only coatings {only including layers} of metallic material · CPC title