Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

Patent metadata

Field	Value
Publication number	US-2016374238-A1
Application number	US-201414902198-A
Country	US
Kind code	A1
Filing date	Jun 30, 2014
Priority date	Jul 4, 2013
Publication date	Dec 22, 2016
Grant date	—

Abstract

A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 μm, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 μmol/dm 2 , and a total adhesion amount of the B element group is 40 to 900 μmol/dm 2 .

First claim

1 . A metal foil for electromagnetic shielding, comprising:
a metal foil base having a thickness of exceeding 4 μm, an alloy layer having an A element composed of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 μmol/dm 2 , and a total adhesion amount of the B element group is 40 to 900 μmol/dm 2 , and wherein a metal layer composed of the A element is not present on the surface of the alloy layer, and a plurality of needle-shaped or columnar-shaped protrusions is not included; each having an average diameter of 0.1 to 2.0 μm represented by an average value of a minimum circle diameter that surrounds a convex part of each protrusion, when the surface of the alloy layer is observed by SEM.

2 . The metal foil for electromagnetic shielding according to claim 1 , wherein the alloy layer is an intermetallic compound.

3 . The metal foil for electromagnetic shielding according to claim 1 , wherein the alloy layer further includes a C element group selected from the group consisting of one or more of P, W, Fe and Co.

4 . The metal foil for electromagnetic shielding according to claim 1 , wherein a total content of the C element group to the entire alloy layer is 40 wt % or less.

5 . The metal foil for electromagnetic shielding according to claim 1 , wherein a total content of Cu, Al and Zn included in the alloy layer is 10 wt % or less.

6 . The metal foil for electromagnetic shielding according to claim 1 , wherein an oxide is formed on the surface of the alloy layer.

7 . The metal foil for electromagnetic shielding according to claim 1 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

8 . The metal foil for electromagnetic shielding according to claim 1 , wherein the base is aluminum or the aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

9 . An electromagnetic shielding material, comprising the metal foil for electromagnetic shielding according to claim 1 , and a resin layer laminated on one surface of the metal foil.

10 . The electromagnetic shielding material according to claim 9 , wherein the resin layer is a resin film.

11 . A shielding cable shielded by the electromagnetic shielding material according to claim 9 .

12 . A shielding cable shielded by the electromagnetic shielding material according to claim 10 .

13 . The metal foil for electromagnetic shielding according to claim 2 , wherein the alloy layer further includes a C element group selected from the group consisting of one or more of P, W, Fe and Co.

14 . The metal foil for electromagnetic shielding according to claim 2 , wherein a total content of the C element group to the entire alloy layer is 40 wt % or less.

15 . The metal foil for electromagnetic shielding according to claim 2 , wherein a total content of Cu, Al and Zn included in the alloy layer is 10 wt % or less.

16 . The metal foil for electromagnetic shielding according to claim 2 , wherein an oxide is formed on the surface of the alloy layer.

17 . The metal foil for electromagnetic shielding according to claim 2 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

18 . The metal foil for electromagnetic shielding according to claim 2 , wherein the base is aluminum or the aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

19 . The metal foil for electromagnetic shielding according to claim 3 , wherein a total content of the C element group to the entire alloy layer is 40 wt % or less.

20 . The metal foil for electromagnetic shielding according to claim 3 , wherein a total content of Cu, Al and Zn included in the alloy layer is 10 wt % or less.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Tanaka Koichiro

Classifications

• Y10T428/12917

  Next to Fe-base component · CPC title

• Y10T428/27

  Web or sheet containing structurally defined element or component, the element or component having a specified weight per unit area [e.g., gms/sq cm, lbs/sq ft, etc.] · CPC title

• B32B15/018

  one layer being formed of a noble metal or a noble metal alloy · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

• Y10T428/12618

  Plural oxides · CPC title