Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

Patent metadata

Field	Value
Publication number	US-9485894-B2
Application number	US-201414902188-A
Country	US
Kind code	B2
Filing date	Feb 20, 2014
Priority date	Jul 3, 2013
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

A metal foil for electromagnetic shielding, comprising: a metal foil base, an Sn—Ni alloy layer formed on one or both surfaces of the base, and an oxide layer formed on a surface of the Sn—Ni alloy layer, wherein the Sn—Ni alloy layer includes 20 to 80% by mass of Sn and has a thickness of 30 to 500 nm, and wherein when an analysis in a depth direction is carried out by an XPS being the depth from an outermost surface as X nm, and an atomic percentage (%) of Sn is represented by A Sn (X), an atomic percentage (%) of Ni is represented by A Ni (X), an atomic percentage (%) of oxygen is represented by A O (X), and X is defined to be X O when A O (X)=0, 30 nm=>X O =>0.5 nm, and 0.4=>∫A Ni (X)dx/∫A Sn (X)dx=>0.05 in a section [0, X 0 ] is satisfied.

First claim

What is claimed is:

1. A metal foil for electromagnetic shielding, comprising:
a metal foil base, an Sn—Ni alloy layer formed on one or both surfaces of the base, and an oxide layer formed on a surface of the Sn—Ni alloy layer, wherein
the Sn—Ni alloy layer includes 20 to 80% by mass of Sn and has a thickness of 30 to 500 nm, and wherein
when an analysis in a depth direction is carried out by XPS with the depth from an outermost surface as X nm, and an atomic percentage (%) of Sn is represented by A Sn (X), an atomic percentage (%) of Ni is represented by A Ni (X), an atomic percentage (%) of oxygen is represented by A O (X), and X is defined to be X O when A O (X)=0, 30 nm≧X O ≧0.5 nm, and 0.4≧∫A Ni (X)dx/∫A Sn (X)dx≧0.05 in a section [0, X 0 ] is satisfied.

2. The metal foil for electromagnetic shielding according to claim 1 , wherein the Sn—Ni alloy layer further includes one or more elements selected from the group consisting of P, W, Fe and Co.

3. The metal foil for electromagnetic shielding according to claim 1 , wherein the Sn—Ni alloy layer includes 10% by mass of an element configuring the base.

4. The metal foil for electromagnetic shielding according to claim 1 , further comprising:
an underlayer composed of a Ni metal layer or an alloy layer of Ni and P, W, Fe, Co or Zn formed between the Sn—Ni alloy layer and the base.

5. The metal foil for electromagnetic shielding according to claim 1 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

6. The metal foil for electromagnetic shielding according to claim 1 , wherein the base is aluminum or an aluminum alloy, and wherein a Zn layer is formed between the base and an underlayer.

7. An electromagnetic shielding material, comprising the metal foil for electromagnetic shielding according to claim 1 , and a resin layer laminated on one surface of the metal foil.

8. The electromagnetic shielding material according to claim 7 , wherein the resin layer is a resin film.

9. A shielding cable shielded by the electromagnetic shielding material according to claim 7 .

10. A shielding cable shielded by the electromagnetic shielding material according to claim 8 .

11. The metal foil for electromagnetic shielding according to claim 2 , wherein the Sn—Ni alloy layer includes 10% by mass of an element configuring the base.

12. The metal foil for electromagnetic shielding according to claim 2 , further comprising:
an underlayer composed of a Ni metal layer or an alloy layer of Ni and P, W, Fe, Co or Zn formed between the Sn—Ni alloy layer and the base.

13. The metal foil for electromagnetic shielding according to claim 3 , further comprising:
an underlayer composed of a Ni metal layer or an alloy layer of Ni and P, W, Fe, Co or Zn formed between the Sn—Ni alloy layer and the base.

14. The metal foil for electromagnetic shielding according to claim 2 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

15. The metal foil for electromagnetic shielding according to claim 3 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

16. The metal foil for electromagnetic shielding according to claim 4 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

17. The metal foil for electromagnetic shielding according to claim 2 , wherein the base is aluminum or an aluminum alloy, and wherein a Zn layer is formed between the base and an underlayer.

18. The metal foil for electromagnetic shielding according to claim 3 , wherein the base is aluminum or an aluminum alloy, and wherein a Zn layer is formed between the base and an underlayer.

19. The metal foil for electromagnetic shielding according to claim 4 , wherein the base is aluminum or an aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

20. The metal foil for electromagnetic shielding according to claim 5 , wherein the base is aluminum or an aluminum alloy, and wherein a Zn layer is formed between the base and an underlayer.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Tanaka Koichiro

Classifications

• B32B2307/212

  Electromagnetic interference shielding · CPC title

• C25D3/562

  containing more than 50% by weight of iron or nickel or cobalt · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title

• C23C28/345

  with at least one oxide layer · CPC title

• C25D5/505 Primary

  of electroplated tin coatings, e.g. by melting · CPC title