Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

Patent metadata

Field	Value
Publication number	US-2016165768-A1
Application number	US-201414902188-A
Country	US
Kind code	A1
Filing date	Feb 20, 2014
Priority date	Jul 3, 2013
Publication date	Jun 9, 2016
Grant date	—

Abstract

A metal foil for electromagnetic shielding, comprising: a metal foil base, an Sn—Ni alloy layer formed on one or both surfaces of the base, and an oxide layer formed on a surface of the Sn—Ni alloy layer, wherein the Sn—Ni alloy layer includes 20 to 80% by mass of Sn and has a thickness of 30 to 500 nm, and wherein when an analysis in a depth direction is carried out by an XPS being the depth from an outermost surface as X nm, and an atomic percentage (%) of Sn is represented by A Sn (X), an atomic percentage (%) of Ni is represented by A Ni (X), an atomic percentage (%) of oxygen is represented by A O (X), and X is defined to be X O when A O (X)=0, 30 nm=>X O =>0.5 nm, and 0.4=>∫A Ni (X)dx/∫A Sn (X)dx=>0.05 in a section [0, X 0 ] is satisfied.

First claim

1 . A metal foil for electromagnetic shielding, comprising:
a metal foil base, an Sn—Ni alloy layer formed on one or both surfaces of the base, and an oxide layer formed on a surface of the Sn—Ni alloy layer, wherein the Sn—Ni alloy layer includes 20 to 80% by mass of Sn and has a thickness of 30 to 500 nm, and wherein when an analysis in a depth direction is carried out by an XPS being the depth from an outermost surface as X nm, and an atomic percentage (%) of Sn is represented by A Sn (X), an atomic percentage (%) of Ni is represented by A Ni (X), an atomic percentage (%) of oxygen is represented by A O (X), and X is defined to be X O when A O (X)=0, 30 nm=>X O =>0.5 nm, and 0.4=>∫A Ni (X)dx/∫A Sn (X)dx=>0.05 in a section [0, X 0 ] is satisfied.

2 . The metal foil for electromagnetic shielding according to claim 1 , wherein the Sn—Ni alloy layer further includes one or more elements selected from the group consisting of P, W, Fe and Co.

3 . The metal foil for electromagnetic shielding according to claim 1 , wherein the Sn—Ni alloy layer includes 10% by mass of an element configuring the base.

4 . The metal foil for electromagnetic shielding according to claim 1 , further comprising:
a underlayer composed of a Ni metal layer or an alloy layer of Ni and P, W, Fe, Co or Zn formed between the Sn—Ni alloy layer and the base.

5 . The metal foil for electromagnetic shielding according to claim 1 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

6 . The metal foil for electromagnetic shielding according to claim 1 , wherein the base is aluminum or the aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

7 . An electromagnetic shielding material, comprising the metal foil for electromagnetic shielding according to claim 1 , and a resin layer laminated on one surface of the metal foil.

8 . The electromagnetic shielding material according to claim 7 , wherein the resin layer is a resin film.

9 . A shielding cable shielded by the electromagnetic shielding material according to claim 7 .

10 . A shielding cable shielded by the electromagnetic shielding material according to claim 8 .

11 . The metal foil for electromagnetic shielding according to claim 2 , wherein the Sn—Ni alloy layer includes 10% by mass of an element configuring the base.

12 . The metal foil for electromagnetic shielding according to claim 2 , further comprising:
a underlayer composed of a Ni metal layer or an alloy layer of Ni and P, W, Fe, Co or Zn formed between the Sn—Ni alloy layer and the base.

13 . The metal foil for electromagnetic shielding according to claim 3 , further comprising:
a underlayer composed of a Ni metal layer or an alloy layer of Ni and P, W, Fe, Co or Zn formed between the Sn—Ni alloy layer and the base.

14 . The metal foil for electromagnetic shielding according to claim 2 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

15 . The metal foil for electromagnetic shielding according to claim 3 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

16 . The metal foil for electromagnetic shielding according to claim 4 , wherein the base is composed of gold, silver, platinum, stainless steel, iron, nickel, zinc, copper, a copper alloy, aluminum or an aluminum alloy.

17 . The metal foil for electromagnetic shielding according to claim 2 , wherein the base is aluminum or the aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

18 . The metal foil for electromagnetic shielding according to claim 3 , wherein the base is aluminum or the aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

19 . The metal foil for electromagnetic shielding according to claim 4 , wherein the base is aluminum or the aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

20 . The metal foil for electromagnetic shielding according to claim 5 , wherein the base is aluminum or the aluminum alloy, and wherein a Zn layer is formed between the base and the underlayer.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Tanaka Koichiro

Classifications

• C25D3/562

  containing more than 50% by weight of iron or nickel or cobalt · CPC title

• B32B2307/714

  Inert, i.e. inert to chemical degradation, corrosion · CPC title

• H05K9/0088

  comprising a plurality of shielding layers; combining different shielding material structure · CPC title

• C25D7/0614

  Strips or foils · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title