Coated round wire
US-2024368794-A1 · Nov 7, 2024 · US
Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10)
Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/10 |
| Official title | Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) |
| Display label | Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) |
| Total patents | 865 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 88 |
| 2016 | 99 |
| 2017 | 85 |
| 2018 | 66 |
| 2019 | 102 |
| 2020 | 93 |
| 2021 | 83 |
| 2022 | 55 |
| 2023 | 68 |
| 2024 | 64 |
| 2025 | 51 |
| 2026 | 11 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Silver-containing film and method for producing same
US-2024279816-A1 · Aug 22, 2024 · US
Printed circuit board (pcb) with wrapped conductor
US-2015382460-A1 · Dec 31, 2015 · US
Electrodeposition of thin-film cells containing non-toxic elements
US-9219186-B2 · Dec 22, 2015 · US
Semiconductor structures having low resistance paths throughout a wafer
US-2015364368-A1 · Dec 17, 2015 · US
Electrochemical plating methods
US-2015357195-A1 · Dec 10, 2015 · US
Methods for depositing metal on a reactive metal film
US-2015348836-A1 · Dec 3, 2015 · US
Metal laminated structure and method for producing the metal laminated structure
US-9199433-B2 · Dec 1, 2015 · US
Steel sheet for hot press-forming, hot press-formed part, and method of producing hot press-formed part
US-2015337415-A1 · Nov 26, 2015 · US
Semiconductor structures having low resistance paths throughout a wafer
US-2015332925-A1 · Nov 19, 2015 · US
Super conformal metal plating from complexed electrolytes
US-2015325477-A1 · Nov 12, 2015 · US
Super conformal plating
US-2015322587-A1 · Nov 12, 2015 · US
Miniature RF and Microwave Components and Methods for Fabricating Such Components
US-2015311575-A1 · Oct 29, 2015 · US
Methods for Fabricating Metal Structures Incorporating Dielectric Sheets
US-2015307997-A1 · Oct 29, 2015 · US
Hardened silver coated journal bearing surfaces and method
US-2015300477-A1 · Oct 22, 2015 · US
Alloying interlayer for electroplated aluminum on aluminum alloys
US-2015299884-A1 · Oct 22, 2015 · US
Method and apparatus for preparing a substrate with a semi-noble metal layer
US-2015299886-A1 · Oct 22, 2015 · US
Electronic component metal material and method for manufacturing the same
US-2015295333-A1 · Oct 15, 2015 · US
Cathode for thin film microbattery
US-2015288023-A1 · Oct 8, 2015 · US
Anodized electroplated aluminum structures
US-2015284868-A1 · Oct 8, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/10?
- CPC C25D5/10 is the Cooperative Patent Classification code for “Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10).”
- How many patents are filed under CPC C25D5/10 (Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10))?
- Our database includes 865 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/10 growing?
- Publication counts under this code: 64 in 2024 vs 51 in 2025 (latest complete years).