Spin chuck with concentrated center and radial heating

Patent metadata

Field	Value
Publication number	US-10658204-B2
Application number	US-201715671410-A
Country	US
Kind code	B2
Filing date	Aug 8, 2017
Priority date	Aug 8, 2017
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

A substrate processing system to treat a substrate includes a spin chuck configured to hold and rotate a substrate. A heating assembly is configured to heat an opposite surface of the substrate and includes a main heater assembly and a nozzle stack cap. The main heater assembly includes a first plurality of light emitting diodes (LEDs) arranged on a first printed circuit board (PCB) in a first plane that is spaced from and parallel to a second plane including the substrate. The nozzle stack cap assembly includes at least one nozzle to dispense liquid onto a center of a first surface of the substrate. A radiant heat source is arranged closer to the substrate than the first plane and is configured to heat the center of the first surface of the substrate.

First claim

What is claimed is:

1. A substrate processing system to treat a substrate, comprising:
a spin chuck configured to hold and rotate a substrate;
a heating assembly configured to heat an opposite surface of the substrate and including:
a main heater assembly including a first plurality of light emitting diodes (LEDs) arranged on a first printed circuit board (PCB) in a first plane that is spaced from and parallel to a second plane including the substrate; and
a nozzle stack cap assembly including:
at least one nozzle to dispense liquid onto a center of a first surface of the substrate; and
a radiant heat source that is arranged closer to the substrate than the first plane and that is configured to heat the center of the first surface of the substrate.

2. The substrate processing system of claim 1 , wherein the radiant heat source is arranged in a third plane that is between the first plane and the second plane.

3. The substrate processing system of claim 1 , further comprising a controller to actuate the first plurality of LEDs in radial and circumferential zones to create a moving heat front.

4. The substrate processing system of claim 3 , wherein the radiant heat source of the nozzle stack cap assembly is connected to one of the one of the radial and circumferential zones.

5. The substrate processing system of claim 1 , wherein the nozzle stack cap assembly includes a second plurality of LEDs that are arranged on a second PCB, wherein the second PCB is arranged in a third plane that is parallel to the first plane and the second plane and that is closer to the second plane than the first plane.

6. The substrate processing system of claim 1 , wherein the nozzle stack cap assembly includes:
a transparent cover arranged over the radiant heat source;
a first hole formed in the transparent cover; and
a first conduit passing through the first hole to deliver liquid to the first surface of the substrate.

7. The substrate processing system of claim 6 , wherein the nozzle stack cap assembly includes:
a second hole formed in the transparent cover; and
a second conduit passing through the second hole to deliver gas to the first surface of the substrate.

8. The substrate processing system of claim 1 , wherein the nozzle stack cap assembly includes:
a second PCB including a second plurality of LEDs;
a body to support the second PCB and defining cooling fins;
a transparent cover arranged over the second PCB;
a first hole formed in the second PCB, the body and the transparent cover;
a second hole formed in the second PCB, the body and the transparent cover;
a first conduit arranged in the first hole to deliver liquid; and
a second conduit arranged in the second hole to deliver gas.

9. The substrate processing system of claim 8 , further comprising a connector to connect the second PCB to the first PCB.

10. The substrate processing system of claim 1 , wherein the nozzle stack cap assembly includes a body, wherein the radiant heat source includes a laser end connector connected to the body.

11. The substrate processing system of claim 10 , wherein the laser end connector is slidably connected to the body to allow axial movement relative to the substrate.

12. The substrate processing system of claim 10 , the nozzle stack cap assembly further comprises:
a transparent cover connected to the body;
a first hole formed in the body and the transparent cover;
a second hole formed in the body and the transparent cover;
a first conduit arranged in the first hole to deliver liquid; and
a second conduit arranged in the second hole to deliver gas.

13. The substrate processing system of claim 10 , further comprising:
fiber connected to the laser end connector;
a connector connected to the fiber; and
a laser connected to the connector.

14. The substrate processing system of claim 1 , further comprising a transparent plate that includes a center opening and that rotates with the spin chuck, wherein the main heater assembly is located below the transparent plate and the nozzle stack cap assembly connected to the main heater assembly and is partially arranged in the center opening.

15. The substrate processing system of claim 14 , further comprising a laser end connector to direct light on a radially outer edge of the substrate.

16. The substrate processing system of claim 15 , further comprising:
fiber connected to the laser end connector;
a connector connected to the fiber; and
a laser connected to the connector.

17. The substrate processing system of claim 15 , wherein the laser end connector is arranged on the PCB.

18. The substrate processing system of claim 17 , wherein the transparent plate includes arcuate openings and wherein light generated by the laser end connector passes through the arcuate openings.

Assignees

• Lam Res Ag

Inventors

• Hill Bridget
• Puggl Michael
• Mueller Gerhard
• Osner Henry Roger
• Hohenwarter Karl-Heinz
• Tschinderle Ulrich
• Brien Daniel

Classifications

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/0408

  for drying · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title