Method and apparatus for liquid treatment of wafer shaped articles

Patent metadata

Field	Value
Publication number	US-8997764-B2
Application number	US-201113118080-A
Country	US
Kind code	B2
Filing date	May 27, 2011
Priority date	May 27, 2011
Publication date	Apr 7, 2015
Grant date	Apr 7, 2015

Abstract

An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions.

First claim

What is claimed is:

1. Apparatus for treating a wafer-shaped article, comprising:
a spin chuck for holding a wafer-shaped article in a predetermined orientation wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck;
at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck; and
at least one lower nozzle arm compri…

Assignees

• Puggl Michael
• Lam Res Ag

Inventors

• Puggl Michael

Classifications

• H10P72/7608

  Electricity · mapped topic

• H10P72/0414

  Electricity · mapped topic

• H10P72/0408 Primary

  Electricity · mapped topic

• H10P50/00 Primary

  Electricity · mapped topic

• H01L21/67051

  Electricity · mapped topic