Electrostatic Chuck With LED Heating

Patent metadata

Field	Value
Publication number	US-2016379853-A1
Application number	US-201514753870-A
Country	US
Kind code	A1
Filing date	Jun 29, 2015
Priority date	Jun 29, 2015
Publication date	Dec 29, 2016
Grant date	—

Abstract

An electrostatic chuck with LED heating is disclosed. The electrostatic chuck with LED heating comprises a first subassembly, which comprises a LED heater, and a second subassembly, which comprises an electrostatic chuck. The LED substrate heater subassembly includes a base having a recessed portion. A plurality of light emitting diodes (LEDs) is disposed within the recessed portion. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The second subassembly, which comprises an electrostatic chuck, is disposed on the LED substrate heater subassembly. The electrostatic chuck includes a top dielectric layer and an interior layer that are transparent at the wavelength emitted by the LEDs. One or more electrodes are disposed between the top dielectric layer and the interior layer to create the electrostatic force.

First claim

What is claimed is:

1 . An apparatus comprising:
a sealed enclosure containing an electrical circuit comprising a plurality of LEDs, wherein a top surface of the sealed enclosure comprises an electrostatic chuck.

2 . The apparatus of claim 1 , wherein the electrostatic chuck comprises:
an interior layer in communication with the sealed enclosure; a top dielectric layer; and an electrode disposed between the interior layer and the top dielectric layer.

3 . The apparatus of claim 1 , wherein the sealed enclosure is filled with an encapsulate to remove air.

4 . The apparatus of claim 1 , wherein the plurality of LEDs emits light at a wavelength between about 0.4 and 1.0 μm.

5 . An electrostatic chuck with LED heating, comprising:
a base having a recessed portion defined by sidewalls; an electrical circuit, comprising a plurality of LEDs, disposed in the recessed portion; an interior layer disposed on top of the sidewalls and covering the recessed portion; a top dielectric layer; and an electrode disposed between the interior layer and the top dielectric layer, wherein the interior layer and the top dielectric layer are transparent at a wavelength emitted by the plurality of LEDs.

6 . The electrostatic chuck of claim 5 , wherein the electrical circuit comprises a printed circuit board, and the printed circuit board is in thermal communication with an upper surface of the recessed portion.

7 . The electrostatic chuck of claim 5 , wherein the electrical circuit comprising insulating traces and conductive traces, wherein the insulating traces are applied directly to an upper surface of the recessed portion, the conductive traces are applied on top of the insulating traces, and the conductive traces are in electrical communication with the plurality of LEDs.

8 . The electrostatic chuck of claim 5 , further comprising an encapsulate which fills a remaining volume of the recessed portion.

9 . The electrostatic chuck of claim 8 , wherein the encapsulate is transparent at the wavelength emitted by the plurality of LEDs.

10 . The electrostatic chuck of claim 9 , wherein the encapsulate comprises silicone.

11 . The electrostatic chuck of claim 5 , wherein the plurality of LEDs is arranged as a pattern of concentric circles, where concentric circles disposed further from a center of the pattern have more LEDs than concentric circles disposed closer to the center of the pattern.

12 . The electrostatic chuck of claim 5 , comprising a conduit passing through the top dielectric layer, the interior layer and the base, in fluid communication with a gas source, to allow gas to be introduced to a volume between the top dielectric layer and an underside of a substrate disposed on the electrostatic chuck.

13 . The electrostatic chuck of claim 5 , wherein the electrode is formed as a mesh, such that the electrode occupies less than 25% of a surface of the interior layer.

14 . The electrostatic chuck of claim 5 , wherein the electrode is formed using a material that is transparent at the wavelength emitted by the plurality of LEDs.

15 . The electrostatic chuck of claim 5 , wherein the plurality of LEDs emits light at a wavelength between about 0.4 and 1.0 μm.

16 . An electrostatic chuck with LED heating, comprising:
a base having a recessed portion defined by sidewalls; an electrical circuit, comprising a plurality of LEDs, disposed in the recessed portion; an interior layer disposed on top of the sidewalls and covering the recessed portion to form a sealed enclosure; an encapsulate filling a remaining volume of the sealed enclosure; a top dielectric layer; and an electrode disposed between the interior layer and the top dielectric layer, wherein the encapsulate, the interior layer, the electrode and the top dielectric layer are transparent at a wavelength emitted by the plurality of LEDs.

17 . The electrostatic chuck of claim 16 , wherein the electrode comprises a doped semiconductor.

18 . The electrostatic chuck of claim 16 , further comprising a conduit extending through the base, the encapsulate, the interior layer and the top dielectric layer, in fluid communication with a gas source, to allow gas to be introduced to a volume between the top dielectric layer and an underside of a substrate disposed on the electrostatic chuck.

19 . The electrostatic chuck of claim 16 , wherein the plurality of LEDs emits light at a wavelength between about 0.4 and 1.0 μm.

20 . The electrostatic chuck of claim 16 , wherein the plurality of LEDs are arranged as a pattern of concentric circles, where concentric circles disposed further from a center of the pattern have more LEDs than concentric circles disposed closer to the center of the pattern.

Assignees

• Varian Semiconductor Equipment Ass Inc

Inventors

• Schaller Jason M
• Weaver William T
• Evans Morgan D
• Vopat Robert Brent
• Pergande Paul E
• Blake Julian G
• Blahnik David
• Moradian Ala

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H10H20/80

  Constructional details · CPC title

• H01L21/67115 Primary

  Electricity · mapped topic