Method and apparatus for determining a fingerprint of a performance parameter

Patent metadata

Field	Value
Publication number	US-10649342-B2
Application number	US-201716308835-A
Country	US
Kind code	B2
Filing date	Jun 22, 2017
Priority date	Jul 11, 2016
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

A lithographic process is one that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. During the lithographic process, the focus should be controlled. There is disclosed a method for determining a fingerprint of a performance parameter associated with a substrate, such as a focus value to be used during the lithographic process. A reference fingerprint of the performance parameter is determined for a reference substrate. A reference substrate parameter of the reference substrate is determined. A substrate parameter for a substrate, such as a substrate with product structures, is determined. Subsequently, the fingerprint of the performance parameter is determined based on the reference fingerprint, the reference substrate parameter and the substrate parameter. The fingerprint may then be used to control the lithographic process.

First claim

The invention claimed is:

1. A method for determining a fingerprint of a performance parameter associated with a substrate, the method comprising;
determining a reference fingerprint of the performance parameter associated with a reference substrate;
determining at least one reference substrate parameter associated with the reference substrate;
determining at least one substrate parameter associated with the substrate; and
determining, by a hardware computer system, the fingerprint of the performance parameter based on the reference substrate parameter, the substrate parameter and the reference fingerprint.

2. The method according to claim 1 , further comprising adjusting operation of a lithographic apparatus based on the fingerprint of the performance parameter.

3. The method according to claim 1 , wherein the performance parameter is a focus setting reflecting a relative position of the substrate or reference substrate with respect to a focal plane of a lithographic apparatus.

4. The method according to claim 3 , wherein the reference fingerprint is determined by measurement of the focus setting across the reference substrate.

5. The method according to claim 1 , wherein the reference substrate parameter comprises a reference height map for the reference substrate.

6. The method according to claim 5 , wherein the reference height map comprises height measurement data obtained by a level sensor.

7. The method according to claim 6 , wherein determining the reference substrate parameter further comprises obtaining additional reference data.

8. The method according to claim 1 , wherein determining the fingerprint of the performance parameter comprises performing a summation of each of the reference fingerprint, reference substrate parameter, and the substrate parameter.

9. The method according to claim 1 , further comprising adjusting one or more selected from: the reference fingerprint, the reference substrate parameter and/or the substrate parameter, so as to cause data points of each of the reference fingerprint, the reference substrate parameter and the substrate parameter to overlap in a reference grid on the surface of the substrate.

10. The method according to claim 1 , further comprising determining an additional fingerprint of at least one parameter of the substrate or reference substrate.

11. The method according to claim 1 , wherein determining a reference fingerprint comprises deriving an inter-field contribution to the reference fingerprint based on a set of reference measurement data.

12. The method according to claim 1 , wherein determining a reference fingerprint comprises deriving an intra-field contribution to the reference fingerprint based on a set of reference measurement data.

13. The method according to claim 1 , wherein the reference fingerprint comprises information associated with a characteristic of the lithographic apparatus.

14. The method according to claim 13 , wherein the information is associated with an optical characteristic of an optical system of the lithographic apparatus.

15. The method according to claim 1 , wherein the performance parameter is an overlay related parameter.

16. The method according to claim 1 , wherein the performance parameter is a critical dimension related parameter.

17. The method according to claim 16 , wherein the reference fingerprint is determined by measurement of critical dimension values across the reference substrate and wherein the reference substrate parameter comprises a stack property map for the reference substrate.

18. A method for manufacturing devices, wherein device features are formed on a series of substrates by a lithographic process, wherein one or more properties of the processed substrates are measured by one or more measuring processes, and wherein the measured one or more properties are used to determine a fingerprint of a performance parameter according to the method of claim 1 .

19. A lithographic apparatus comprising means for carrying out the method of claim 1 .

20. A non-transitory computer program product containing one or more sequences of machine-readable instructions, that when executed by a computer system, are configured to cause the computer system to at least:
determine a reference fingerprint of a performance parameter associated with a reference substrate;
determine at least one reference substrate parameter associated with the reference substrate;
determine at least one substrate parameter associated with a substrate; and
determine the fingerprint of the performance parameter associated with the substrate based on the reference substrate parameter, the substrate parameter and the reference fingerprint.

Assignees

• Asml Netherlands Bv

Inventors

• Van Der Logt Léon Maria Albertus
• Segers Bart Peter Bert
• Van Gorp Simon Hendrik Celine
• Luijten Carlo Cornelis Maria
• Staals Frank

Classifications

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• G03F7/70783

  Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight · CPC title

• G03F7/70641 Primary

  Focus · CPC title

• G03F7/705 Primary

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title

• G03F7/70525

  Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure · CPC title