Substrate processing apparatus, substrate processing method and memory medium

Patent metadata

Field	Value
Publication number	US-10528028-B2
Application number	US-201715421565-A
Country	US
Kind code	B2
Filing date	Feb 1, 2017
Priority date	Mar 5, 2014
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

A substrate processing system includes a film-forming device to form photosensitive film on substrate, an exposure device to expose the film on the substrate, a relay device to transfer the substrate between the film-forming and exposure devices, a warping data acquisition device to acquire measured warping data of the substrate, a communication device to perform data communication with the exposure device, and a control device including film-forming, relay, measuring, and communication control sub-devices. The film-forming sub-device controls the film-forming device to form the film on the substrate, the relay sub-device controls the relay device to transfer the substrate to the exposure device, the measuring sub-device controls the warping data acquisition device to acquire the data after the controlling by the film-forming sub-device prior to the controlling by the relay sub-device, and the communication sub-device controls the communication device to transmit the data to the exposure device.

First claim

What is claimed is:

1. A substrate processing system, comprising:
a film-forming device configured to form a photosensitive film on a front surface of a substrate;
an exposure device configured to expose the photosensitive film formed on the substrate;
a relay device positioned between the film-forming device and the exposure device and configured to transfer the substrate between the film-forming device and the exposure device;
a warping data acquisition device configured to measure a back surface of the substrate such that measured warping data of the substrate having the photosensitive film formed thereon are acquired;
a communication device configured to perform data communication with the exposure device such that the measured warping data of the substrate are transmitted to the exposure device; and
a control device comprising circuitry configured to control the film-forming device such that the film-forming device forms the photosensitive film on the front surface of the substrate, control the relay device such that the relay device transfers the substrate having the photosensitive film to the exposure device, control the warping data acquisition device such that the warping data acquisition device measures the back surface of the substrate and acquires the measured warping data after controlling the firm-forming device prior to controlling the relay device, determine whether roughening process is to be applied on the back surface of the substrate based on the measured warping data prior to transferring the substrate to the exposure device, and control the communication device such that the communication device transmits the measured warping data to the exposure device.

2. A substrate processing system according to claim 1 , further comprising:
a roughening process device configured to apply roughening process on the back surface of the substrate,
wherein the circuitry of the control device is configured to control the roughening process device such that the roughening process device applies the roughening process on the back surface of the substrate based on the measured warping data after controlling the warping data acquisition device prior to the controlling the relay device.

3. A substrate processing system according to claim 1 , wherein the warping data acquisition device includes a holding device configured to hold a periphery of the substrate and a measuring device configured to measure warping of the substrate held by the holding device.

4. A substrate processing system according to claim 3 , wherein the measuring device is positioned on a back side of the substrate held by the holding device such that the measuring device is configured to measure a distance to the back surface of the substrate.

5. A substrate processing system according to claim 4 , wherein the warping data acquisition device includes a back-surface inspection device configured to detect a contaminant attached to the back surface of the substrate.

6. A substrate processing system according to claim 5 , wherein the measuring device comprises a laser displacement gauge configured to scan laser on the back surface of the substrate and measure the distance to the back surface of the substrate, and the back surface inspection device comprises an image inspection device configured to take an image and detect the contaminant from the image.

7. A substrate processing system according to claim 6 , wherein the warping data acquisition device includes a transfer device configured to transfer the substrate such that the transfer device changes spots whose images are taken by the back surface inspection device, and the measuring device is configured to move laser irradiation spots in a direction which intersects with a direction in which the substrate is transferred by the transfer device and measure the distance to the irradiation spots.

8. A substrate processing system according to claim 5 , wherein the circuitry of the control device is configured to control the warping data acquisition device such that the back-surface inspection device inspects the contaminant after controlling the film-forming device prior to controlling the measuring device.

9. A substrate processing system, comprising:
a film-forming device configured to form a photosensitive film on a front surface of a substrate;
an exposure device configured to expose the photosensitive film formed on the substrate;
a relay device positioned between the film-forming device and the exposure device and configured to transfer the substrate between the film-forming device and the exposure device;
a warping data acquisition device configured to measure a back surface of the substrate such that measured warping data of the substrate having the photosensitive film formed thereon are acquired;
a roughening process device configured to apply roughening process on the back surface of the substrate; and
a control device comprising circuitry configured to control the film-forming device such that the film-forming device forms the photosensitive film on the front surface of the substrate, control the relay device such that the relay device transfers the substrate having the photosensitive film to the exposure device, control the warping data acquisition device such that the warping data acquisition device measures the back surface of the substrate and acquires the measured warping data after controlling the film-forming device prior to controlling the relay device, determine whether roughening process is to be applied on the back surface of the substrate based on the measured warping data prior to transferring the substrate to the exposure device, and control the roughening process device such that the roughening process device applies the roughening process on the back surface of the substrate based on the measured warping data after controlling the warping data acquisition device prior to controlling the relay device.

10. A substrate processing system according to claim 9 , wherein the warping data acquisition device includes a holding device configured to hold a periphery of the substrate and a measuring device configured to measure warping of the substrate held by the holding device.

11. A substrate processing system according to claim 10 , wherein the measuring device is positioned on a back side of the substrate held by the holding device such that the measuring device is configured to measure a distance to the back surface of the substrate.

12. A substrate processing system according to claim 11 , wherein the warping data acquisition device includes a back-surface inspection device configured to detect a contaminant attached to the back surface of the substrate.

13. A substrate processing system according to claim 12 , wherein the measuring device comprises a laser displacement gauge configured to scan laser on the back surface of the substrate and measure the distance to the back surface of the substrate, and the back surface inspection device comprises an image inspection device configured to take an image and detect the contaminant from the image.

14. A substrate processing system according to claim 13 , wherein the warping data acquisition device includes a transfer device configured to transfer the substrate such that the transfer device changes spots whose images are taken by the back surface inspection device, and the measuring device is configured to move laser irradiation spots in a direction which intersects with a direction in which the substrate is transferred by the transfer device and measure the distance to the irradiation spots.

15. A substrate processing system according to c

Assignees

• Tokyo Electron Ltd

Inventors

• Kodama Teruhiko
• Enomoto Masashi

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23 Primary

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P72/3202

  Mechanical details, e.g. rollers or belts · CPC title

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0474

  comprising at least one lithography chamber · CPC title