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Method and System for Positioning Center of V-Type Notch of Wafer, and Computer Storage Medium

US2024266198A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024266198-A1
Application numberUS-202218568629-A
CountryUS
Kind codeA1
Filing dateOct 21, 2022
Priority dateOct 21, 2021
Publication dateAug 8, 2024
Grant date—

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

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A method is for positioning a center of a V-type notch of a wafer. The method includes: determining, based on collected edge data of a V-type notch of a wafer, a center of a concentric circle corresponding to edges of the V-type notch; and judging, based on a position relation between the center and a set reference scale line, whether the V-type notch is at a preset target center position. The method also includes determining, based on the position relation between the center and the set reference scale line, a rotation direction and rotation angle of the wafer when the V-type notch is out of the preset target center position; and driving, according to the rotation direction and rotation angle of the wafer, the wafer to rotate until the V-type notch is rotated to the preset target center position.

First claim

Opening claim text (preview).

1 . A method for positioning a center of a V-type notch of a wafer, comprising: determining, based on collected edge data of the V-type notch of the wafer, a center of a concentric circle corresponding to edges of the V-type notch; wherein the determining, based on the collected edge data of the V-type notch of the wafer, the center of the concentric circle corresponding to the edges of the V-type notch comprises: rotating the wafer until the V-type notch is rotated to below a line laser conto…

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What does patent US2024266198A1 cover?
A method is for positioning a center of a V-type notch of a wafer. The method includes: determining, based on collected edge data of a V-type notch of a wafer, a center of a concentric circle corresponding to edges of the V-type notch; and judging, based on a position relation between the center and a set reference scale line, whether the V-type notch is at a preset target center position. The …
Who is the assignee on this patent?
Xi’An Eswin Material Tech Co Ltd, Xi’An Eswin Silicon Wafer Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/53. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Aug 08 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).