Cooling element for an electrostatic chuck assembly

Patent metadata

Field	Value
Publication number	US-10490435-B2
Application number	US-201815890946-A
Country	US
Kind code	B2
Filing date	Feb 7, 2018
Priority date	Feb 7, 2018
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

An electrostatic chuck assembly with improved thermal uniformity and stability is disclosed herein. The electrostatic chuck assembly includes a puck having a chucking electrode disposed therein and a cooling base connected to the puck. The cooling base is formed a first material and includes a top surface, a first cooling channel, a second cooling channel configured to flow coolant therethrough independent of flow through the first cooling channel, and a first thermal spreading element aligned with the first cooling channel and disposed between the first cooling channel and the puck. The first thermal spreading element is formed from a second material that has a thermal conductivity higher than a thermal conductivity of the first material.

First claim

What is claimed is:

1. An electrostatic chucking assembly comprising:
a puck having a chucking electrode disposed therein; and
a cooling base connected to the puck, the cooling base formed from a first material and comprising:
a top surface;
a first cooling channel;
a second cooling channel configured to flow coolant therethrough independent of flow through the first cooling channel; and
a first thermal spreading element aligned with the first cooling channel and disposed between the first cooling channel and the puck, the first thermal spreading element formed from a second material having a thermal conductivity higher than a thermal conductivity of the first material, wherein the first thermal spreading element comprises:
a recess area formed within the top surface of the cooling base, wherein the second material is disposed within the recess area; and
a cap disposed over the recess area.

2. The electrostatic chucking assembly of claim 1 , wherein the cooling base further comprises:
a second thermal spreading element aligned with the second cooling channel and disposed between the second cooling channel and the puck, the second thermal spreading element separate from the first thermal spreading element.

3. The electrostatic chucking assembly of claim 2 , wherein the cooling base further comprises a thermal break between the first thermal spreading element and the second thermal spreading element.

4. The electrostatic chucking assembly of claim 3 , wherein the thermal break comprises a third material having a thermal conductivity lower than the thermal conductivity of the first material.

5. The electrostatic chucking assembly of claim 1 , wherein the cap is flush with the top surface of the cooling base.

6. The electrostatic chucking assembly of claim 1 , wherein the first thermal spreading element comprises more than two discrete portions.

7. The electrostatic chucking assembly of claim 1 , wherein the first material is aluminum and the second material is thermally annealed pyrolytic graphite (TPG).

8. The electrostatic chucking assembly of claim 1 , wherein the first cooling channel is concentric with the second cooling channel.

9. The electrostatic chucking assembly of claim 1 , wherein the first cooling channel and the first thermal spreading element comprise at least one of a common shape and common width.

10. An electrostatic chucking assembly comprising:
a puck having a chucking electrode disposed therein; and
a cooling base connected to the puck, the cooling base formed from a first material and comprising:
a top surface;
a first cooling channel;
a second cooling channel configured to flow coolant therethrough independent of flow through the first cooling channel; and
a first thermal spreading element aligned with the first cooling channel and disposed between the first cooling channel and the puck, the first thermal spreading element formed from a second material having a thermal conductivity higher than a thermal conductivity of the first material, wherein the first cooling channel and the first thermal spreading element comprise a ring-like shape.

11. A semiconductor processing chamber comprising:
a chamber body;
an electrostatic chucking assembly disposed in the chamber body, the electrostatic chucking assembly comprising:
a puck having a chucking electrode disposed therein; and
a cooling base connected to the puck, the cooling base formed from a first material and comprising:
a top surface;
a first cooling channel;
a second cooling channel configured to flow coolant therethrough independent of flow through the first cooling channel; and
a first thermal spreading element aligned with the first cooling channel and disposed between the first cooling channel and the puck, the first thermal spreading element formed from a second material having a thermal conductivity higher than a thermal conductivity of the first material, wherein the first cooling channel and the first thermal spreading element comprise one of a common shape and a common size; and

a substrate support disposed in the chamber body and having the electrostatic chuck assembly disposed thereon.

12. The semiconductor processing chamber of claim 11 , wherein the cooling base further comprises:
a second thermal spreading element aligned with the second cooling channel and disposed between the second cooling channel and the puck, the second thermal spreading element separate from the first thermal spreading element.

13. The semiconductor processing chamber of claim 12 , wherein the first thermal spreading element further comprises a thermal break between the first and second thermal spreading elements.

14. The semiconductor processing chamber of claim 13 , wherein the thermal break comprises a third material having a thermal conductivity lower than the thermal conductivity of the second material.

15. The semiconductor processing chamber of claim 11 , wherein the first thermal spreading element comprises:
a recess area formed within the top surface of the cooling base, wherein the second material is disposed within the recess area; and
a cap disposed on said recess area.

16. The semiconductor processing chamber of claim 15 , wherein the cap is flush with the top surface of the cooling base.

17. The semiconductor processing chamber of claim 11 , wherein the first thermal spreading element comprises more than two discrete portions.

18. The semiconductor processing chamber of claim 11 , wherein the common shape is a ring-like shape.

Assignees

• Applied Materials Inc

Inventors

• Willwerth Michael D
• Cotlear Roberto Cesar
• Schmid Andreas

Classifications

• Y10T279/23

  with magnetic or electrostatic means · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title