Mounting table and plasma processing apparatus

Patent metadata

Field	Value
Publication number	US-9589823-B2
Application number	US-201214367058-A
Country	US
Kind code	B2
Filing date	Dec 17, 2012
Priority date	Dec 20, 2011
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

A mounting table includes an electrostatic chuck, a base, and a cylindrical sleeve. The electrostatic chuck has a top surface to be exposed to plasma and a bottom surface opposite to the top surface, and a first through-hole is formed through the electrostatic chuck. The base is bonded to the bottom surface of the electrostatic chuck by a first adhesive, and a second through-hole is formed through the base. The second through-hole communicates with the first through-hole and has a diameter larger than a diameter of the first through-hole. The sleeve is bonded to the bottom surface of the electrostatic chuck by a second adhesive while communicating with the first through-hole.

First claim

What is claimed is:

1. A mounting table comprising:
an electrostatic chuck having a top surface to be exposed to a plasma and a bottom surface opposite to the top surface, the electrostatic chuck including a first through-hole formed therethrough;
a base bonded to the bottom surface of the electrostatic chuck by a first adhesive, the base including a second through-hole formed therethrough, the second through-hole communicating with the first through-hole and having a diameter larger than a diameter of the first through-hole; and
a tubular sleeve,
wherein the sleeve is bonded to the bottom surface of the electrostatic chuck by a second adhesive while communicating with the first through-hole,
wherein the second adhesive has a higher resistance to the plasma or radicals than that of the first adhesive,
wherein the first adhesive is an organic adhesive including a silicon-based material, an acrylic-based or acrylate-based material, or a polyimide silica-based material,
wherein the second adhesive is an inorganic adhesive including a ceramic material, and
wherein the sleeve is spaced apart from an inner wall of the second through-hole.

2. The mounting table of claim 1 , wherein the sleeve has an inner diameter equal to the diameter of the first through-hole and is bonded to the bottom surface of the electrostatic chuck so as to be coaxial with the first through-hole.

3. The mounting table of claim 1 , wherein the first adhesive is provided only at a contact portion between the electrostatic chuck and the base.

4. The mounting table of claim 1 , wherein the sleeve has an outer diameter smaller than the second through-hole.

5. The mounting table of claim 4 , further comprising a sealant filled in a space defined by the sleeve and the second through-hole.

6. The mounting table of claim 5 , wherein the sealant is filled in the space by flowing into the space and then being cured.

7. The mounting table of claim 6 , wherein the sealant has a viscosity of 20000 cps or less before curing and a Young's Modulus of 1 MPa or less after the curing.

8. The mounting table of claim 1 , wherein the sleeve is made of the same insulating material as an insulating material of the electrostatic chuck.

9. The mounting table of claim 8 , wherein the sleeve is made of ceramic.

10. The mounting table of claim 5 , wherein the sealant is formed to isolate the first adhesive from an atmosphere.

11. The mounting table of claim 1 , further comprising a sealant filled in a space between the inner wall of the second through-hole and the sleeve, wherein the sealant isolates the first adhesive from both the first through hole and the second through hole.

12. A plasma processing apparatus comprising:
a processing chamber including therein a processing space in which a plasma is to be generated;
a gas supply unit configured to supply a processing gas into the processing space;
a first electrode provided in the processing space;
a mounting table, accommodated in the processing chamber, for mounting thereon a substrate,
wherein the mounting table includes:
an electrostatic chuck having a top surface to be exposed to a plasma and a bottom surface opposite to the top surface, the electrostatic chuck including a first through-hole formed therethrough;
a base bonded to the bottom surface of the electrostatic chuck by a first adhesive, the base including a second through-hole formed therethrough, the second through-hole communicating with the first through-hole and having a diameter larger than a diameter of the first through-hole; and
a tubular sleeve,
wherein the base serves as a second electrode, and
wherein the sleeve is bonded to the bottom surface of the electrostatic chuck by a second adhesive while communicating with the first through-hole,
wherein the second adhesive has a higher resistance to the plasma or radicals than that of the first adhesive,
wherein the first adhesive is an organic adhesive including a silicon-based material, an acrylic-based or acrylate-based material, or a polyimide silica-based material,
wherein the second adhesive is an inorganic adhesive including a ceramic material, and
wherein the sleeve is spaced apart from an inner wall of the second through-hole.

Assignees

• Tokyo Electron Ltd

Inventors

• Sasaki Yasuharu
• Sugamata Takeshi
• Aoto Tadashi

Classifications

• H10P72/70

  for supporting or gripping · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H01L21/6831

  Electricity · mapped topic