Compliant polishing pad and polishing module

Patent metadata

Field	Value
Publication number	US-2016005618-A1
Application number	US-201414476991-A
Country	US
Kind code	A1
Filing date	Sep 4, 2014
Priority date	Jul 3, 2014
Publication date	Jan 7, 2016
Grant date	—

Abstract

A polishing device includes a housing, a flexible base coupled to the housing, and a contact region disposed on a first side of the flexible base, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base.

First claim

1 . A polishing device, comprising:
a housing; a flexible base coupled to the housing; and a contact region disposed on a first side of the flexible base, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base.

2 . The device of claim 1 , wherein the contact region is raised from the flexible base.

3 . The device of claim 1 , wherein the contact region is positioned on the base along an arc segment.

4 . The device of claim 1 , wherein the contact region comprises a plurality of contact pads.

5 . The device of claim 1 , wherein the flexible base comprises a raised lip at a perimeter thereof.

6 . The device of claim 1 , wherein the contact area is adjustable.

7 . The device of claim 6 , wherein the adjustment of the contact area is based on a process recipe.

8 . The device of claim 1 , wherein the contact region is arc-shaped.

9 . The device of claim 1 , wherein the contact region is circular.

10 . A polishing module, comprising:
a chuck having a substrate receiving surface and a perimeter; and a polishing pad positioned about the perimeter of the chuck, the polishing pad comprising a contact region positioned about a center of a flexible base, wherein the polishing pad is inflatable by pressure application to a backside of the flexible base.

11 . The module of claim 10 , wherein the contact region is detachably coupled to the flexible base.

12 . The module of claim 10 , wherein the contact region is arc-shaped.

13 . The module of claim 10 , wherein the contact region is circular.

14 . A method of polishing a substrate, comprising:
urging a polishing pad disposed on a housing against a surface of a substrate, the polishing pad being disposed on a flexible base; and adjusting a contact area of the polishing pad by adjusting a pressure to a backside of the flexible base, wherein the contact area is less than a surface area of the flexible base.

15 . The method of claim 14 , wherein the adjusting of the contact area is based on a process recipe.

16 . The method of claim 15 , wherein the contact area conforms to the surface of the substrate.

17 . The method of claim 14 , wherein the contact area is arc-shaped.

18 . The method of claim 17 , wherein the contact area conforms to the surface of the substrate.

19 . The method of claim 14 , wherein the contact area is circular.

20 . The method of claim 19 , wherein the contact area conforms to the surface of the substrate.

Assignees

• Applied Materials Inc

Inventors

• Chen Chih Hung
• Gurusamy Jay
• Zuniga Steven M

Classifications

• B24B41/047 Primary

  Grinding heads for working on plane surfaces · CPC title

• B24B37/10

  for single side lapping · CPC title

• H01L21/67092

  Electricity · mapped topic

• H01L21/30625 Primary

  Electricity · mapped topic

• H10P52/402

  of semiconductor materials · CPC title