Retaining ring for cmp
US-2026061550-A1 · Mar 5, 2026 · US
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Oh Jeonghoon patents
Oh Jeonghoon is listed as an inventor on 165 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Oh Jeonghoon |
| Total patents | 165 |
| First publication | Jan 22, 2015 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Control of platen edge-shape in chemical mechanical polishing
US-2026042184-A1 · Feb 12, 2026 · US
Membrane for applying pressure to pad in chemical mechanical polishing
US-2026021555-A1 · Jan 22, 2026 · US
Flexure mounted pad for chemical mechanical polishing
US-2026021554-A1 · Jan 22, 2026 · US
Chemical mechanical polishing using flexure mounted pad
US-2026021551-A1 · Jan 22, 2026 · US
Retaining ring having inner surfaces with features
US-2026008150-A1 · Jan 8, 2026 · US
In-situ conditioner disk cleaning during CMP
US-12459078-B2 · Nov 4, 2025 · US
Substrate handling systems and methods for CMP processing
US-12454036-B2 · Oct 28, 2025 · US
In-situ conditioner disk cleaning during cmp
US-2025326086-A1 · Oct 23, 2025 · US
Eddy current monitoring to detect vibration in polishing
US-2025326084-A1 · Oct 23, 2025 · US
Recent patents
Latest publications not already listed above.
Chemical mechanical polishing vibration measurement using optical sensor
US-12447579-B2 · Oct 21, 2025 · US
Contact cleaning units in cmp polisher
US-2025319570-A1 · Oct 16, 2025 · US
Retaining ring having inner surfaces with features
US-12434348-B2 · Oct 7, 2025 · US
Eddy current monitoring to detect vibration in polishing
US-12403561-B2 · Sep 2, 2025 · US
Electrical connection for chemical mechanical polishing carrier head
US-2025269488-A1 · Aug 28, 2025 · US
Polishing head with retaining ring wear sensing
US-2025235977-A1 · Jul 24, 2025 · US
Multiple disk pad conditioner
US-12337439-B2 · Jun 24, 2025 · US
Cmp with individually rotatable platens
US-2025114899-A1 · Apr 10, 2025 · US
High speed injection nozzle for pre-polish modification of substrate thickness
US-2025114910-A1 · Apr 10, 2025 · US
Individually rotatable platens and control of carrier head sweep
US-2025114896-A1 · Apr 10, 2025 · US
Polishing head with decoupled membrane position control
US-2025108473-A1 · Apr 3, 2025 · US
Polishing head with flexure extending through pressure chamber
US-2025108479-A1 · Apr 3, 2025 · US
Chemical mechanical polishing edge control with pad recesses
US-2025108477-A1 · Apr 3, 2025 · US
Gas amplifier for cmp cooling
US-2025073850-A1 · Mar 6, 2025 · US
Control of platen shape in chemical mechanical polishing
US-2024424636-A1 · Dec 26, 2024 · US
Method and apparatus to clean substrate with atomizing nozzle
US-2024408650-A1 · Dec 12, 2024 · US
Chemical mechanical polish pad conditioner with multiple disks
US-2024391056-A1 · Nov 28, 2024 · US
Steam generation for chemical mechanical polishing
US-2024342855-A1 · Oct 17, 2024 · US
Retaining ring having inner surfaces with features
US-2024316723-A1 · Sep 26, 2024 · US
Methods for upper platen manufacturing
US-2024307963-A1 · Sep 19, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 165 |
| Oh Jeonghoon | 3 |
| Wu Banqiu | 1 |
| Patibandla Nag B | 1 |
| Fujita Toshiaki | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B24B37/32 | 54 |
| B24B37/30 | 39 |
| B24B37/005 | 33 |
| B24B37/042 | 32 |
| H10P52/00 | 32 |