Accommodating device for retaining wafers

Patent metadata

Field	Value
Publication number	US-10325798-B2
Application number	US-201514693074-A
Country	US
Kind code	B2
Filing date	Apr 22, 2015
Priority date	Dec 20, 2010
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.

First claim

Having described the invention, the following is claimed:

1. A method for alignment of a first wafer with a second wafer, comprising:
detecting at least one of:
a first wafer vector field with distortion vectors of the first wafer that respectively correspond with local distortions of the first wafer out of which a global distortion of the first wafer arises, and
a second wafer vector field with distortion vectors of the second wafer that respectively correspond with local distortions of the second wafer out of which a global distortion of the second wafer arises,

evaluating the at least one of the first wafer and second wafer vector fields of at least one of the first and second wafers and determining local alignment errors based on the evaluated at least one of the first wafer and second wafer vector fields,
receiving at least one of the first and second wafers on a receiving means, said receiving means including a mounting surface, mounting means for mounting of the at least one of the first and second wafers onto the mounting surface, and compensation means for active, locally controllable, compensation of the local distortions of the at least one of the first and second wafers such that the global distortion of the at least one of the first and second wafers is locally controlled and at least partially compensated,
aligning the first and second wafers with each other based on the at least one of the first wafer and second wafer vector fields with simultaneous compensation by the compensation means, and
contacting and bonding the first and second wafers in a stack, the contacting and bonding comprising:
determining local alignment errors that occur as a result of said contacting and bonding, and
simultaneously correcting in-situ, during the contacting and bonding, the local alignment errors that occur during the contacting and bonding with the compensation means.

2. The method as claimed in claim 1 , wherein, after the aligning, detecting a second vector field of the at least one of the first and second wafers.

3. The method as claimed in claim 1 , further comprising:
locally controlling a temperature of the mounting surface by the compensation means.

4. The method as claimed in claim 1 , further comprising:
locally controlling a strain of the mounting surface by the compensation means,
wherein the compensation means comprises piezoelements arranged on a back side of the mounting surface.

5. The method as claimed in claim 1 , further comprising:
locally controlling a shape of the mounting surface by the compensation means,
wherein the compensation means comprises mechanical means configured to move in a Z direction.

6. The method as claimed in claim 1 , further comprising:
locally controlling an exposure of a back side of the mounting surface to hydraulic and/or pneumatic pressure by the compensation means.

7. The method as claimed in claim 1 , wherein the compensation means comprises a plurality of active control elements integrated into the mounting surface of the receiving means.

8. The method as claimed in claim 7 , wherein each control element or respective groups of the control elements is separately activated.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Wimplinger Markus
• Wagenleitner Thomas
• Filbert Alexander

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/0616 Primary

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P72/50 Primary

  for positioning, orientation or alignment · CPC title