High-pressure container, substrate processing apparatus, and method for manufacturing high-pressure container

Patent metadata

Field	Value
Publication number	US-10207349-B2
Application number	US-201314086146-A
Country	US
Kind code	B2
Filing date	Nov 21, 2013
Priority date	Nov 29, 2012
Publication date	Feb 19, 2019
Grant date	Feb 19, 2019

Abstract

In the present disclosure, the high-pressure chamber includes a chamber main body including a flat rectangular parallelepiped block of a metal which is formed with a flat cavity that serves as a substrate processing space in which a processing using a high-pressure fluid is performed on a substrate, and the substrate processing space being formed by machining the block from one of faces of the block other than the widest face towards another face opposing thereto. In a case where the cavity is constituted as a through hole, the though hole is provided with a cover configured to open or close the cavity on one side of the through hole, and a second block configured to air-tightly seal the cavity on the other side.

First claim

What is claimed is:

1. A high-pressure container comprising:
a container body including a flat rectangular parallelepiped block of a metal which is formed with a flat cavity that serves as a substrate processing space in which a processing using a high-pressure fluid is performed on a substrate, the flat cavity being formed by machining the flat rectangular parallelepiped block from one of faces of the flat rectangular parallelepiped block other than a widest face towards another face opposing thereto; and
a cover configured to open/close the substrate processing space,
wherein at least one of inner wall surfaces of the flat cavity is coated with a plating layer of a noble metal, and an electroless nickel plating layer is interposed between the inner wall surfaces of the flat cavity and the plating layer of the noble metal, and
a thickness of the plating layer of the noble metal is about 0.2 μm.

2. The high-pressure container of claim 1 , wherein the container body is formed with a through hole on at least one of the faces of the block by the machining, and one end of the through hole is air-tightly sealed by a metal member.

3. The high-pressure container of claim 2 , wherein the machining is a wire cut electric discharge machining.

4. The high-pressure container of claim 1 , wherein the machining is performed by a die-sinking electric discharge machining in which an electrode formed in a shape corresponding to a shape of the cavity is sequentially brought into close proximity to the block so as to form a cavity which is not penetrated.

5. The high-pressure container of claim 1 , wherein the widest face has a short side and a long side that is longer than the short side, and the face on which the cavity is opened is a face at the short side.

6. The high-pressure container of claim 1 , further comprising a substrate holding unit configured to restrain a position of the substrate such that the substrate is opposite to the widest face.

7. The high-pressure container of claim 1 , wherein a distance between the inner wall surfaces of the cavity is in a range of 5 mm to 15 mm.

8. A high-pressure container comprising:
a container body including a block of metal in which a flat cavity is opened on at least one of faces serving as a processing space for a substrate,
wherein a plating layer of a noble metal is formed on an inner wall surface of the block, and a cover is provided to open or close the processing space, thereby allowing a processing on the substrate using a high-pressure fluid,
an electroless nickel plating layer is interposed between the inner wall surface of the block and the plating layer of the noble metal, and
a thickness of the plating layer of the noble metal is about 0.2 μm.

9. The high-pressure container of claim 8 , wherein the block has a flat rectangular parallelepiped shape, and the at least one of faces is a face other than a widest face of all faces of the block.

10. The high-pressure container of claim 9 , wherein the widest face has a short side and a long side that is longer than the short side and the face on which the cavity is opened is a face at the short side.

11. The high-pressure container of claim 9 , further comprising a substrate holding unit configured to restrain a position of the substrate such that the substrate is opposite to the widest face.

12. The high-pressure container of claim 9 , wherein a distance between inner wall surfaces of the cavity is in a range of 5 mm to 15 mm.

13. The high-pressure container of claim 8 , wherein the cavity of the block penetrates from one face to another face opposing thereto, and a metal member is air-tightly bonded to one face among the faces of the block on which a through hole is opened.

14. A substrate processing apparatus, comprising:
the high-pressure container of claim 1 ;
a fluid supply line connected to the high-pressure container and configured to supply a high-pressure fluid or a row material fluid that becomes the high-pressure fluid when performing at least one of heating and pressurization; and
a fluid discharge line configured to discharge the high-pressure fluid in the high-pressure container.

Assignees

• Tokyo Electron Ltd

Inventors

• Mitsuoka Kazuyuki
• You Gen
• Ohno Hiroki
• Orii Takehiko
• Toshima Takayuki
• Inadomi Hiroaki

Classifications

• H10P72/3406

  involving removal of lid, door or cover · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/00 Primary

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title