Methods and apparatuses for atomic layer cleaning of contacts and vias

Patent metadata

Field	Value
Publication number	US-9362163-B2
Application number	US-201414446203-A
Country	US
Kind code	B2
Filing date	Jul 29, 2014
Priority date	Jul 30, 2013
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

Described are cleaning methods for removing contaminants from an electrical contact interface of a partially fabricated semiconductor substrate. The methods may include introducing a halogen-containing species into a processing chamber, and forming an adsorption-limited layer, which includes halogen from the halogen-containing species, atop the electrical contact interface and/or the contaminants thereon. The methods may further include thereafter removing un-adsorbed halogen-containing species from the processing chamber and activating a reaction between the halogen of the adsorption-limited layer and the contaminants present on the electrical contact interface. The reaction may then result in the removal of at least a portion of the contaminants from the electrical contact interface. In some embodiments, the halogen adsorbed onto the surface and reacted may be fluorine. Also described herein are apparatuses having controllers for implementing such electrical contact interface cleaning techniques.

First claim

The invention claimed is:

1. A cleaning method for removing contaminants from an electrical contact interface of a partially fabricated semiconductor substrate in a processing chamber, the contact interface for making an electrical connection with a metal, the method comprising:
(a) introducing a halogen-containing species into the processing chamber;
(b) forming an adsorption-limited layer atop the electrical contact interface and/or contaminants thereon, the adsorption-limited layer comprising halogen from the halogen-containing species;
(c) after (b), removing un-adsorbed halogen-containing species from the processing chamber; and
(d) activating a reaction between the halogen of the adsorption-limited layer and the contaminants present on the electrical contact interface, the reaction resulting in the removal of at least a portion of the contaminants from the electrical contact interface

wherein the contaminants comprise one or more fluorocarbon polymer species deposited in a prior fabrication operation involving a reactive ion etch of the partially-manufactured semiconductor substrate.

2. The method of claim 1 , wherein activating the reaction in (d) comprises reacting an additional chemical species with the halogen and/or halogen-containing species of the adsorption-limited layer.

3. The method of claim 1 , wherein activating the reaction in (d) comprises providing thermal energy to the adsorption-limited layer.

4. The method of claim 1 , wherein activating the reaction in (d) comprises exposing the adsorption-limited layer to an ion and/or free-radical species of a plasma.

5. The method of claim 4 , wherein activating the reaction in (d) further comprises directing an ion species of the plasma toward the adsorption-limited layer by applying an electromagnetic field to the ion species such that it contacts the adsorption-limited layer.

6. The method of claim 5 , wherein application of the electromagnetic field to the ion species causes it to contact the adsorption-limited layer while having a velocity substantially perpendicular to the plane of the semiconductor substrate.

7. The method of claim 5 , wherein the ion species contacts the adsorption-limited layer by impacting it with a relative kinetic energy of less than 100 eVs.

8. The method of Claim 4 , further comprising:
(f) after (d), reacting metal fluorides and/or metal oxides present on the electrical contact interface with the ion and/or free-radical species present in the plasma, the reaction resulting in the removal of at least a portion of the metal fluorides and/or metal oxides from the electrical contact interface.

9. The method of claim 1 , further comprising:
(e) removing halogen-containing species generated by the reaction in (d) from the processing chamber.

10. The method of claim 1 , wherein the halogen-containing species introduced in (a) is an interhalogen selected from the group consisting of:
XeF 2 , BrF 3 , IF 5 ,and ClF 3 .

11. The method of claim 1 , wherein the electrical contact interface comprises Si, Ge, and/or GaAs.

12. The method of claim 11 , wherein the electrical contact interface comprises SiGe.

13. The method of claim 11 , wherein the electrical contact interface comprises Si and further comprises a metal silicide layer atop at least some portion of the underlying Si.

14. The method of claim 13 , wherein the metal silicide layer comprises Ni silicide, Ti silicide, and/or Co silicide.

15. The method of claim 11 , wherein the electrical contact interface comprises Ge and further comprises a metal germanide layer atop at least some portion of the underlying Ge.

16. The method of claim 15 , wherein the metal germanide layer comprises Ti germanide, Ni gemanide, and/or Co germanide.

17. The method of claim 1 , wherein the halogen is fluorine.

Assignees

• Lam Res Corp

Inventors

• Danek Michal
• Gao Juwen
• Fellis Aaron
• Juarez Francisco
• Lai Chiukin Steven

Classifications

• H10P70/234 Primary

  the processing being the formation of vias or contact holes · CPC title

• H10W20/081

  by forming openings in the dielectric parts · CPC title

• H10W20/032 Primary

  of conductive barrier, adhesion or liner layers · CPC title

• C23G5/00 Primary

  Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents · CPC title

• H01L21/76814

  Electricity · mapped topic