Image processing method and image processing apparatus for transforming objects within an image
US-12586147-B2 · Mar 24, 2026 · US
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Yang Mei patents
Yang Mei is listed as an inventor on 52 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Mei |
| Total patents | 52 |
| First publication | Aug 4, 2015 |
| Latest publication | Mar 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Flexible circuit board and method of fabricating the same
US-12513821-B2 · Dec 30, 2025 · US
Play mute circuit and method
US-12470187-B2 · Nov 11, 2025 · US
Touch Scanning Method, Touch Chip, Display Module, and Electronic Device
US-2025306714-A1 · Oct 2, 2025 · US
Image processing method and image processing apparatus
US-12400382-B2 · Aug 26, 2025 · US
Flexible circuit board and method of fabricating the same
US-2025031306-A1 · Jan 23, 2025 · US
Method and apparatus for compensating for brightness of display panel, and device
US-2024386834-A1 · Nov 21, 2024 · US
Circuit board and preparation method thereof
US-12114424-B2 · Oct 8, 2024 · US
Method for manufacturing multilayer printed circuit board
US-12016119-B2 · Jun 18, 2024 · US
Transparent circuit board
US-2024196541-A1 · Jun 13, 2024 · US
Recent patents
Latest publications not already listed above.
Image processing method and image processing apparatus
US-2024127507-A1 · Apr 18, 2024 · US
Method for manufacturing transparent circuit board
US-11950371-B2 · Apr 2, 2024 · US
Image processing method and image processing apparatus
US-2024087079-A1 · Mar 14, 2024 · US
Camera module and method for manufacturing the same
US-11902644-B2 · Feb 13, 2024 · US
Play mute circuit and method
US-2023378923-A1 · Nov 23, 2023 · US
Method and apparatus of embedding image in video, and method and apparatus of acquiring plane prediction model
US-2023368324-A1 · Nov 16, 2023 · US
Method for manufacturing a circuit board with embedded nickel resistor
US-11665831-B2 · May 30, 2023 · US
Transparent circuit board and method for manufacturing the same
US-2023089856-A1 · Mar 23, 2023 · US
Circuit board and preparation method thereof
US-2022322530-A1 · Oct 6, 2022 · US
Camera module and method for manufacturing the same
US-2022191361-A1 · Jun 16, 2022 · US
Method for manufacturing circuit board
US-11294285-B2 · Apr 5, 2022 · US
Method for manufacturing multilayer printed circuit board
US-2022095451-A1 · Mar 24, 2022 · US
Circuit board with embedded electronic component and method for manufacturing the same
US-2022071020-A1 · Mar 3, 2022 · US
Multilayer printed circuit board and method for manufacturing the same
US-11234331-B2 · Jan 25, 2022 · US
Multilayer printed circuit board and method for manufacturing the same
US-2021337665-A1 · Oct 28, 2021 · US
Back-to-back power switch controller
US-10917086-B2 · Feb 9, 2021 · US
Back-To-Back Power Switch Controller
US-2020366287-A1 · Nov 19, 2020 · US
Method for manufacturing circuit board
US-2020236783-A1 · Jul 23, 2020 · US
Method for manufacturing circuit board
US-10653011-B2 · May 12, 2020 · US
Composite circuit board
US-10638606-B2 · Apr 28, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Avary Holding Shenzhen Co Ltd | 24 |
| Hongqisheng Prec Electronics Qinhuangdao Co Ltd | 23 |
| St Microelectronics Srl | 14 |
| Stmicroelectronics Shenzhen R&D Co Ltd | 11 |
| Stmicroelectronics (Shenzhen) R&D Co Ltd | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H03F3/183 | 12 |
| H05K3/06 | 12 |
| H05K1/115 | 12 |
| H03G3/348 | 11 |
| H05K3/4644 | 11 |