Multilayer printed circuit board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11234331-B2
Application number	US-202016887463-A
Country	US
Kind code	B2
Filing date	May 29, 2020
Priority date	Apr 22, 2020
Publication date	Jan 25, 2022
Grant date	Jan 25, 2022

Abstract

A multilayer printed circuit board providing large current and high power includes an inner circuit laminated structure, a first adding-layer circuit base board, and second adding-layer circuit base board. The inner circuit laminated structure includes at least one first type and second type conductive circuit layer alternately stacked. The first and second type conductive circuit layer are respectively made of first and second type metal layer, the first and second type metal layer have different etching ability. The second adding-layer circuit base board and the first adding-layer circuit base board are formed on opposite surfaces of the inner circuit laminated structure. The first and second adding-layer circuit base boards are electrically connected to the inner circuit laminated structure. The disclosure also provides a method for manufacturing such multilayer printed circuit board.

First claim

What is claimed is:

1. A multilayer printed circuit board, comprising:
an inner circuit laminated structure, wherein the inner circuit laminated structure comprises at least one first type conductive circuit layer and at least one second type conductive circuit layer that are alternately stacked together; the first type conductive circuit layer and the second type conductive circuit layer are respectively made of a first type metal layer and a second type metal layer; and the first type metal layer and the second type metal layer both have different etching ability;
a first adding-layer circuit base board formed on the inner circuit laminated structure, wherein the first adding-layer circuit base board is electrically connected to the inner circuit laminated structure; and
a second adding-layer circuit base board formed on the inner circuit laminated structure, wherein the second adding-layer circuit base board and the first adding-layer circuit base board are formed on two opposite surfaces of the inner circuit laminated structure; the second adding-layer circuit base board is electrically connected to the inner circuit laminated structure;
wherein the inner circuit laminated structure comprises a plurality of inner-layer circuits, the inner-layer circuits has a positive trapezoidal shape, an inverted trapezoidal shape, or a funnel shape formed by a positive trapezoidal shape and an inverted trapezoidal shape;
wherein trenches are defined between two adjacent inner-layer circuits; the multilayer printed circuit board further comprises a first adhesive layer and a second adhesive layer, the first adhesive layer is formed between the inner circuit laminated structure and the first adding-layer circuit base board, the second adhesive layer is formed between the inner circuit laminated structure and the second adding-layer circuit base board, a portion of the first adhesive layer and a portion of the second adhesive layer infill in the trenches;
wherein the inner circuit laminated structure comprises a first conductive circuit layer, a second conductive circuit layer, a third conductive circuit layer, and a fourth conductive circuit layer; the first conductive circuit layer and the fourth conductive circuit layer belong to the second type conductive circuit layer, the second conductive circuit layer and the third conductive circuit layer belong to the first type conductive circuit layer;
wherein the first adhesive layer is formed on the first conductive circuit layer, and the second adhesive layer is formed on the third conductive circuit layer;
a plurality of first trenches is defined in the first conductive circuit layer, and the first trenches is used to form a circuit pattern of the first conductive circuit layer; a plurality of second trenches is defined in the second conductive circuit layer, and the second trenches is used to form a circuit pattern of the second conductive circuit layer; a plurality of third trenches is defined in the third conductive circuit layer, and the third trenches is used to form a circuit pattern of the third conductive circuit layer; a plurality of fourth trenches is defined in the fourth conductive circuit layer, and the fourth trenches is used to form a circuit pattern of the fourth conductive circuit layer; a portion of the first adhesive layer infills in the first trenches and the second trenches, and a portion of the second adhesive layer infills in the third trenches and the fourth trenches.

2. The multilayer printed circuit board of claim 1 , wherein a material of the first type metal layer is copper, and a material of the second type metal layer is silver.

3. The multilayer printed circuit board of claim 1 , wherein the first adding-layer circuit base board comprises a first substrate layer formed on the first adhesive layer, the second adding-layer circuit base board comprises a second substrate layer formed on the second adhesive layer; and the flowability of the first adhesive layer and the second adhesive layer is better than that of the first substrate layer and the second substrate layer.

4. The multilayer printed circuit board of claim 1 , wherein the multilayer printed circuit board further comprises at least one conductive through hole, the second adding-layer circuit base board is electrically connected to the first adding-layer circuit base board; and the multilayer printed circuit board further comprises:
a third adhesive layer formed on the first adding-layer circuit base board;
a fourth adhesive layer formed on the second adding-layer circuit base board; a portion of the fourth adhesive layer and a portion of the third adhesive layer infill in the at least one conductive through hole;
a third adding-layer circuit base board formed on the third adhesive layer, the third adding-layer circuit base board is electrically connected to the first adding-layer circuit base board; and
a fourth adding-layer circuit base board formed on the fourth adhesive layer, and the fourth adding-layer circuit base board is electrically connected to the second adding-layer circuit base board.

Assignees

• Hongqisheng Prec Electronics Qinhuangdao Co Ltd
• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinghuangdao Co Ltd

Inventors

• Li Cheng-Jia
• Yang Mei

Classifications

• H05K3/46

  Manufacturing multilayer circuits · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H05K2201/095

  Conductive through-holes or vias · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title