Method for manufacturing transparent circuit board

Patent metadata

Field	Value
Publication number	US-11950371-B2
Application number	US-201916966118-A
Country	US
Kind code	B2
Filing date	Aug 22, 2019
Priority date	Aug 22, 2019
Publication date	Apr 2, 2024
Grant date	Apr 2, 2024

Abstract

A method for manufacturing a transparent circuit board includes the following steps. A composite substrate including a conductive layer and a transparent insulating layer on the conductive layer is provided. A wiring groove is formed on the transparent insulating layer by laser ablation and a carbon black layer is formed on an inner wall of the wiring groove. The wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer. A conductive wiring corresponding to the wiring groove is formed and fully fills the wiring groove. A black oxide treatment is performed on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer. A transparent cover film is pressed on a side of the transparent insulating layer facing away from the conductive layer. The conductive layer is removed.

First claim

What is claimed is:

1. A method for manufacturing a transparent circuit board, comprising:
providing a composite substrate, the composite substrate comprising a conductive layer and a transparent insulating layer on the conductive layer;
forming a wiring groove on the transparent insulating layer by laser ablation, and forming a carbon black layer on an inner wall of the wiring groove, wherein the wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer;
forming a conductive wiring corresponding to the wiring groove, the conductive wiring fully filling the wiring groove;
performing a black oxide treatment on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer;
pressing a transparent cover film on a side of the transparent insulating layer facing away from the conductive layer; and
removing the conductive layer.

2. The method for manufacturing the transparent circuit board of claim 1 , wherein the conductive layer is a nickel plate.

3. The method for manufacturing the transparent circuit board of claim 1 , wherein a surface roughness of the blackened layer is greater than a surface roughness of the carbon black layer.

4. The method for manufacturing the transparent circuit board of claim 1 , wherein the composite substrate comprises two transparent insulating layers on opposite surfaces of the conductive layer.

5. The method for manufacturing the transparent circuit board of claim 1 , wherein a line width of the conductive wiring is less than 8 μm, and a thickness of the conductive wiring is greater than 10 μm.

Assignees

• Hongqisheng Prec Electronics Qinhuangdao Co Ltd
• Avary Holding Shenzhen Co Ltd

Inventors

• Li Cheng-Jia
• Yang Mei

Classifications

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H05K3/0097 Primary

  Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence) · CPC title

• H05K3/0026 Primary

  by laser ablation · CPC title

• H05K3/465

  by applying an insulating layer having channels for the next circuit layer · CPC title

• H05K3/107

  by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title