Integrated circuit device
US-2026068298-A1 · Mar 5, 2026 · US
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Yang Junggil patents
Yang Junggil is listed as an inventor on 72 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Junggil |
| Total patents | 72 |
| First publication | Mar 26, 2015 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device including a field effect transistor and method of fabricating the same
US-12563827-B2 · Feb 24, 2026 · US
Methods of manufacturing semiconductor devices
US-2026052753-A1 · Feb 19, 2026 · US
Semiconductor device
US-2026026100-A1 · Jan 22, 2026 · US
Semiconductor devices
US-2025359203-A1 · Nov 20, 2025 · US
Semiconductor devices
US-2025351418-A1 · Nov 13, 2025 · US
Integrated circuit device including N-channel metal-oxide semiconductor (NMOS) transistor region and a P-channel metal-oxide semiconductor (PMOS) transistor region
US-12433017-B2 · Sep 30, 2025 · US
Semiconductor devices
US-2025294870-A1 · Sep 18, 2025 · US
Display device including a sensing layer for sensing an external input device and method of drving the same
US-12408391-B2 · Sep 2, 2025 · US
Semiconductor devices
US-12382653-B2 · Aug 5, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor device and method of fabricating the same
US-2025248084-A1 · Jul 31, 2025 · US
Semiconductor device
US-2025248063-A1 · Jul 31, 2025 · US
Semiconductor device
US-12300751-B2 · May 13, 2025 · US
Semiconductor devices
US-2025107159-A1 · Mar 27, 2025 · US
Semiconductor device
US-2025089299-A1 · Mar 13, 2025 · US
Semiconductor devices
US-12211942-B2 · Jan 28, 2025 · US
Semiconductor device
US-12183796-B2 · Dec 31, 2024 · US
Method of manufacturing an integrated circuit device
US-2024339450-A1 · Oct 10, 2024 · US
Semiconductor device including a field effect transistor and method of fabricating the same
US-2024339451-A1 · Oct 10, 2024 · US
Integrated circuit device
US-2024321992-A1 · Sep 26, 2024 · US
Semiconductor device and method of fabricating the same
US-2024321884-A1 · Sep 26, 2024 · US
Semiconductor device and method of fabricating the same
US-2024313097-A1 · Sep 19, 2024 · US
Method of manufacturing an integrated circuit device
US-12040326-B2 · Jul 16, 2024 · US
Semiconductor device including a field effect transistor and method of fabricating the same
US-12027523-B2 · Jul 2, 2024 · US
Integrated circuit devices and methods of manufacturing the same
US-11961914-B2 · Apr 16, 2024 · US
Integrated circuits and methods of manufacturing the same
US-11894463-B2 · Feb 6, 2024 · US
Integrated circuit device
US-2024030283-A1 · Jan 25, 2024 · US
Semiconductor devices
US-2024021730-A1 · Jan 18, 2024 · US
Method of manufacturing an integrated circuit device
US-2023335552-A1 · Oct 19, 2023 · US
Semiconductor devices
US-11784256-B2 · Oct 10, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 74 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D30/6735 | 68 |
| H10D30/6757 | 54 |
| H01L29/42392 | 45 |
| H10D30/62 | 41 |
| H10D30/797 | 40 |