Leveler compositions for use in copper deposition in manufacture of microelectronics
US-12398480-B2 · Aug 26, 2025 · US
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Whitten Kyle patents
Whitten Kyle is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Whitten Kyle |
| Total patents | 28 |
| First publication | Aug 17, 2017 |
| Latest publication | Aug 26, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Composition and Method for Fabrication of Nickel Interconnects
US-2025243596-A1 · Jul 31, 2025 · US
Composition and method for fabrication of nickel interconnects
US-12270121-B2 · Apr 8, 2025 · US
Copper Electrodeposition in Microelectronics
US-2024018678-A1 · Jan 18, 2024 · US
Cobalt chemistry for smooth topology
US-11807951-B2 · Nov 7, 2023 · US
Copper deposition in wafer level packaging of integrated circuits
US-11697884-B2 · Jul 11, 2023 · US
Cobalt filling of interconnects in microelectronics
US-11434578-B2 · Sep 6, 2022 · US
Cobalt filling of interconnects
US-11401618-B2 · Aug 2, 2022 · US
Cobalt chemistry for smooth topology
US-2022136123-A1 · May 5, 2022 · US
Composition and Method for Fabrication of Nickel Interconnects
US-2022064811-A1 · Mar 3, 2022 · US
Recent patents
Latest publications not already listed above.
Cobalt chemistry for smooth topology
US-11230778-B2 · Jan 25, 2022 · US
Copper Deposition in Wafer Level Packaging of Integrated Circuits
US-2021388519-A1 · Dec 16, 2021 · US
Leveler compositions for use in copper deposition in manufacture of microelectronics
US-11168406-B2 · Nov 9, 2021 · US
Cobalt Filling of Interconnects
US-2021332491-A1 · Oct 28, 2021 · US
Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics
US-2021310141-A1 · Oct 7, 2021 · US
Copper deposition in wafer level packaging of integrated circuits
US-11124888-B2 · Sep 21, 2021 · US
Cobalt Filling of Interconnects in Microelectronics
US-2021222314-A1 · Jul 22, 2021 · US
Cobalt chemistry for smooth topology
US-2021180200-A1 · Jun 17, 2021 · US
Cobalt filling of interconnects
US-11035048-B2 · Jun 15, 2021 · US
Cobalt filling of interconnects in microelectronics
US-10995417-B2 · May 4, 2021 · US
Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics
US-2020063280-A1 · Feb 27, 2020 · US
Cobalt Filling of Interconnects in Microelectronics
US-2020040478-A1 · Feb 6, 2020 · US
Leveler compositions for use in copper deposition in manufacture of microelectronics
US-10519557-B2 · Dec 31, 2019 · US
Copper Electrodeposition in Microelectronics
US-2019390356-A1 · Dec 26, 2019 · US
Copper Deposition in Wafer Level Packaging of Integrated Circuits
US-2019368064-A1 · Dec 5, 2019 · US
Levelers for copper deposition in microelectronics
US-10294574-B2 · May 21, 2019 · US
Cobalt Filling of Interconnects
US-2019010624-A1 · Jan 10, 2019 · US
Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics
US-2017233883-A1 · Aug 17, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Macdermid Enthone Inc | 28 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D7/123 | 28 |
| H10P14/47 | 23 |
| C25D5/02 | 15 |
| H10W20/0261 | 13 |
| H10W20/023 | 13 |