Leveler compositions for use in copper deposition in manufacture of microelectronics

Patent metadata

Field	Value
Publication number	US-12398480-B2
Application number	US-202117347934-A
Country	US
Kind code	B2
Filing date	Jun 15, 2021
Priority date	Feb 12, 2016
Publication date	Aug 26, 2025
Grant date	Aug 26, 2025

Abstract

An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:

First claim

What is claimed is:

1. A process for synthesizing a quaternized polymer, the process comprising the steps of, in order:
a) dispersing a poly(epihalohydrin) in a polar organic solvent to produce a reaction medium, wherein the polar organic solvent has a boiling point (neat) of at least 120° C.;
b) adding a tertiary amine to the reaction medium and maintaining the reaction medium at a temperature in the range of 160° C. to 190° C. for 0.5 hours to 3 hours to form a quaternized poly(epihalohydrin) solution comprising the quaternized poly(epihalohydrin) in the polar organic solvent.

2. The process according to claim 1 , wherein the quaternized poly(epihalohydrin) comprises n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:

wherein X is a halo substituent, Q is a reaction product of a pendent methylene halide group of poly(epihalohydrin) with the tertiary amine, and a ratio of n/(n+p) is in the range of 0.1 to 0.9.

3. The process according to claim 1 , wherein the tertiary amine is selected from the group consisting of: (i) NR 1 R 2 R 3 wherein each of R 1 , R 2 and R 3 is independently selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted alkynyl, substituted or unsubstituted alicyclic, substituted or unsubstituted aralkyl, substituted or unsubstituted aryl and substituted or unsubstituted heterocyclic; (ii) an N-substituted and optionally further substituted heteroalicyclic amine wherein the N-substituent is selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alicyclic, substituted or unsubstituted aralkyl, substituted or unsubstituted aryl, and substituted or unsubstituted heterocyclic; and (iii) a substituted or unsubstituted nitrogen-containing heteroaryl compound.

4. The process according to claim 1 , wherein the tertiary amine is selected from the group consisting of 3-hydroxypropyldimethylamine, n-butyldimethylamine, di(3-hydroxypropyl)methylamine, 2,3-dihydroxypropyldimethylamine, 3-hydroxypropyldiethylamine, 2-hydroxypropyldimethylamine, 4-hydroxybutyldimethylamine, 2-hydroxyethyldimethylamine, n-propyldimethylamine, 2-hydroxyethoxyethyldimethylamine, di(2-hydroxyethyl)methylamine, benzyldimethylamine, 4-hydroxybenzyldimethyleamine, 3-dimethylamine-1-propanol, 3-hydroxypropyl dimethylamine, 2-dimethylamino-1-ethanol, n-butyl dimethylamine, and N,N-dimethylbenzylamine, 4-ethylpyridine, and 1-methylimidazole, 1-benzylimidazole, N-methylmorpholine, and 2-[2-(dimethylamino)ethoxy]ethanol.

5. The process according to claim 1 , wherein the polar organic solvent is selected from the group consisting of ethylene glycol, propylene glycol, glycerin, ethylene glycol monomethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, and dipropylene glycol monomethyl ether.

6. The process as set forth in claim 1 , wherein steps a) and b) are conducted at ambient pressure.

7. The process as set forth in claim 1 , wherein the polar organic solvent has a boiling point (neat) in the range of about 160° C. to about 200° C.

8. The process as set forth in claim 1 , wherein the quaternized poly(epihalohydrin) comprises monomer units derived from epichlorohydrin.

9. The process according to claim 1 , wherein the molecular weight of the poly(epihalohydrin) is within the range of about 300 to about 4,000 g/mol.

10. The process according to claim 9 , wherein the molecular weight of the poly(epihalohydrin) is within the range of about 1,700 to about 2,200 g/mol.

11. The process according to claim 1 , wherein the solution comprising the quaternized poly(epihalohydrin) in the polar organic solvent is cooled.

12. The process according to claim 1 , wherein the solution comprising the quaternized poly(epihalohydrin) in the polar organic solvent comprises between 25 and 60 wt. % of the quaternized poly(epihalohydrin) in relation to the polar organic solvent.

13. The process according to claim 1 , wherein the solution comprising the quaternized poly(epihalohydrin) in the polar organic solvent comprises a weight ratio of quaternized poly(epihalohydrin) to polar organic solvent within a range of about 0.2:1 to 1.5:1.

14. The process according to claim 2 , wherein the quaternized poly(epihalohydrin) comprises repeating units that are residues of one or more alkylene oxides selected from the group consisting of ethylene oxide, propylene oxide, butylene oxide, 3,4-epoxy-1-butanol, 2,3-epoxy-1-propanol, glycidol, and combinations of the foregoing.

15. The process according to claim 14 , wherein the number of alkylene oxide units in the quaternized poly(epihalohydrin) is q, and a ratio of q/n+p+q is less than 0.05.

Assignees

• Macdermid Enthone Inc

Inventors

• Paneccasio Jr Vincent
• Whitten Kyle
• Richardson Thomas B
• Li Ivan

Classifications

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10P14/46

  using a liquid · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W20/023

  the interconnections being through-semiconductor vias · CPC title

• C08L71/03

  Polyepihalohydrins · CPC title