ADHERED SAP SUBSTRATE FOR CuBOL ASSEMBLY PACKAGE
US-2026090414-A1 · Mar 26, 2026 · US
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We Hong Bok patents
We Hong Bok is listed as an inventor on 231 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | We Hong Bok |
| Total patents | 231 |
| First publication | Apr 30, 2015 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic component placed on core of substrate
US-12581966-B2 · Mar 17, 2026 · US
Package substrate with core having metallization layers to facilitate signal routing within the core, and related fabrication methods and integrated circuit (ic) packages
US-2026040973-A1 · Feb 5, 2026 · US
Package comprising a first substrate, a second substrate and an electrical device coupled to a bottom surface of the second substrate
US-12543599-B2 · Feb 3, 2026 · US
Substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength, and related IC packages and fabrication methods
US-12500146-B2 · Dec 16, 2025 · US
Hybrid dtc embedding substrate
US-2025379162-A1 · Dec 11, 2025 · US
Integrated device with conductive pillar structure for die interconnection
US-2025300056-A1 · Sep 25, 2025 · US
Package substrate
US-2025300050-A1 · Sep 25, 2025 · US
Package with a substrate comprising embedded escape interconnects and surface escape interconnects
US-12424559-B2 · Sep 23, 2025 · US
Buried bump structure
US-2025293136-A1 · Sep 18, 2025 · US
Recent patents
Latest publications not already listed above.
Substrate with buried glass core
US-2025294685-A1 · Sep 18, 2025 · US
Package substrate with a reserve capacitor
US-2025293147-A1 · Sep 18, 2025 · US
Package comprising integrated devices and an interconnection device
US-2025273626-A1 · Aug 28, 2025 · US
Package comprising a substrate including a via interconnect with a partial concentric planar cross section
US-2025273522-A1 · Aug 28, 2025 · US
Package comprising substrates with post interconnects
US-2025253217-A1 · Aug 7, 2025 · US
Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methods
US-12381174-B2 · Aug 5, 2025 · US
Bridge die in substrate core layer
US-2025183178-A1 · Jun 5, 2025 · US
Substrate including conductive stud on pad structure
US-2025140700-A1 · May 1, 2025 · US
Device with side-by-side integrated circuit devices
US-2025132262-A1 · Apr 24, 2025 · US
Package comprising a substrate with an interconnect block
US-2025098066-A1 · Mar 20, 2025 · US
Package comprising a substrate with via interconnect with vertical walls
US-2025096091-A1 · Mar 20, 2025 · US
Package comprising a substrate with a passive component block
US-2025096111-A1 · Mar 20, 2025 · US
Package substrate employing film substrate and an outer pre-impregnated (ppg) substrate(s) to support high density bump and wire bond connections, and related hybrid integrated circuit (ic) packages and fabrication methods
US-2025079281-A1 · Mar 6, 2025 · US
Package comprising a substrate with an embedded passive device
US-2025079348-A1 · Mar 6, 2025 · US
Package comprising channel interconnects located between solder interconnects
US-12243855-B2 · Mar 4, 2025 · US
Integrated device with embedded interconnect structure
US-2025070034-A1 · Feb 27, 2025 · US
Package substrate with metallization layer(s) that includes an additional metal pad layer to facilitate reduced via size for reduced bump pitch, and related integrated circuit (ic) packages and fabrication methods
US-2025062235-A1 · Feb 20, 2025 · US
Structure for delamination mitigation in a semiconductor device
US-2025062246-A1 · Feb 20, 2025 · US
Recess structure for padless stack via
US-12230552-B2 · Feb 18, 2025 · US
Inkjet printing dedicated test pins
US-2024421105-A1 · Dec 19, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 231 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 151 |
| H10W70/685 | 147 |
| H10W90/701 | 146 |
| H10W90/00 | 140 |
| H10W70/65 | 120 |