Quasi-monolithic integrated packaging architecture with mid-die serializer/deserializer
US-12599033-B2 · Apr 7, 2026 · US
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Wang Peipei patents
Wang Peipei is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Peipei |
| Total patents | 19 |
| First publication | Jun 16, 2020 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Lane repair and lane reversal implementation for die-to-die (D2D) interconnects
US-12591727-B2 · Mar 31, 2026 · US
Forwarded supply voltage for dynamic voltage and frequency scaling with stacked chip packaging architecture
US-12519084-B2 · Jan 6, 2026 · US
Clock interpolation system for eye-centering
US-12500583-B2 · Dec 16, 2025 · US
Cellulose foams for high-performance insulation
US-2025171605-A1 · May 29, 2025 · US
Scalable and interoperable PHYLESS die-to-die IO solution
US-12159840-B2 · Dec 3, 2024 · US
Cellulose foams for high-performance insulation
US-12152120-B2 · Nov 26, 2024 · US
Power-forwarding bridge for inter-chip data signal transfer
US-12100662-B2 · Sep 24, 2024 · US
Cellulose foams for high-performance insulation
US-2023331949-A1 · Oct 19, 2023 · US
Cellulose foams for high performance insulations
US-11725091-B2 · Aug 15, 2023 · US
Recent patents
Latest publications not already listed above.
Forwarded supply voltage for dynamic voltage and frequency scaling with stacked chip packaging architecture
US-2023245999-A1 · Aug 3, 2023 · US
Microelectronic die including swappable phy circuitry and semiconductor package including same
US-2023230923-A1 · Jul 20, 2023 · US
Quasi-monolithic integrated packaging architecture with mid-die serializer/deserializer
US-2023197676-A1 · Jun 22, 2023 · US
Packaging architecture with integrated circuit dies over input/output interfaces
US-2023197675-A1 · Jun 22, 2023 · US
Lane repair and lane reversal implementation for die-to-die (d2d) interconnects
US-2022327276-A1 · Oct 13, 2022 · US
Power-forwarding bridge for inter-chip data signal transfer
US-2022199537-A1 · Jun 23, 2022 · US
Scalable and interoperable phyless die-to-die io solution
US-2021398906-A1 · Dec 23, 2021 · US
Cellulose foams for high performance insulations
US-2020392301-A1 · Dec 17, 2020 · US
Clock phase compensation apparatus and method
US-10686582-B1 · Jun 16, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 14 |
| Univ Washington State | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 12 |
| H10W90/00 | 12 |
| H10W70/611 | 12 |
| H10W70/65 | 10 |
| H10W70/618 | 9 |