Integrated circuit die stack with a back-side power delivery network
US-2026096473-A1 · Apr 2, 2026 · US
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Wang Liwei patents
Wang Liwei is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Liwei |
| Total patents | 29 |
| First publication | Jun 15, 2017 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Systems and methods for lateral stacking of die
US-2026076257-A1 · Mar 12, 2026 · US
Lateral silicon bridge for stacked dies
US-2025364486-A1 · Nov 27, 2025 · US
Systems and methods for stack construction of a semiconductor device having redistribution layers in a silicon carrier
US-2025323212-A1 · Oct 16, 2025 · US
Systems and methods for packaging a semiconductor device
US-2025293210-A1 · Sep 18, 2025 · US
Integrated circuit die stack with a bridge die
US-2025246580-A1 · Jul 31, 2025 · US
Integrated circuit die stack with a dual-sided bridge die
US-2025246519-A1 · Jul 31, 2025 · US
Integrated circuit die stack with a bridge die
US-2025167192-A1 · May 22, 2025 · US
Chip-on-wafer face-to-back hybrid bonding without support carrier
US-2025112047-A1 · Apr 3, 2025 · US
Methods and structures for increasing capacitance density in integrated passive devices
US-2025096161-A1 · Mar 20, 2025 · US
Recent patents
Latest publications not already listed above.
Hybrid methods and structures for increasing capacitance density in integrated passive devices
US-2025098184-A1 · Mar 20, 2025 · US
Chip complex with embedded interposer
US-2024404897-A1 · Dec 5, 2024 · US
Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control
US-11804470-B2 · Oct 31, 2023 · US
3D buildup of thermally conductive layers to resolve die height differences
US-11670561-B2 · Jun 6, 2023 · US
Code recommender for resolving a new issue received by an issue tracking system
US-11157246-B2 · Oct 26, 2021 · US
Identifying implicit dependencies between code artifacts
US-11119761-B2 · Sep 14, 2021 · US
Code recommender for resolving a new issue received by an issue tracking system
US-2021208855-A1 · Jul 8, 2021 · US
3d buildup of thermally conductive layers to resolve die height differences
US-2021193547-A1 · Jun 24, 2021 · US
Coupling a magnet with a MEMS device
US-11022792-B2 · Jun 1, 2021 · US
Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control
US-2021057381-A1 · Feb 25, 2021 · US
Identifying implicit dependencies between code artifacts
US-2021049008-A1 · Feb 18, 2021 · US
Device loss prediction, prevention, and recovery
US-10887759-B1 · Jan 5, 2021 · US
Coupling a magnet with a mems device
US-2019391386-A1 · Dec 26, 2019 · US
Two material high K thermal encapsulant system
US-10475715-B2 · Nov 12, 2019 · US
Apparatus and system for storing and transporting magnetic devices
US-10315200-B2 · Jun 11, 2019 · US
Apparatus and system for stroring and transporting magnetic devices
US-2019001342-A1 · Jan 3, 2019 · US
Microelectromechanical system with spring for magnet placement
US-10125013-B2 · Nov 13, 2018 · US
Microelectromechanical system with spring for magnet placement
US-2018134547-A1 · May 17, 2018 · US
Two material high k thermal encapsulant system
US-2017170088-A1 · Jun 15, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 12 |
| Advanced Micro Devices Inc | 12 |
| IBM | 5 |
| Ati Technologies Ulc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 15 |
| H01L25/50 | 9 |
| H10W90/724 | 6 |
| H10W90/722 | 6 |
| H10W72/072 | 5 |