Coupling a magnet with a MEMS device

Patent metadata

Field	Value
Publication number	US-11022792-B2
Application number	US-201616464257-A
Country	US
Kind code	B2
Filing date	Dec 27, 2016
Priority date	Dec 27, 2016
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

First claim

What is claimed is:

1. An apparatus, comprising:
a chassis;
a microelectromechanical systems (MEMS) device on the chassis;
a magnetic element on the chassis, proximate to the MEMS device; and
an adhesive material contacting the magnetic element, wherein the MEMS device and the magnetic element are magnetically coupled, and the magnetic element is between the MEMS device and the adhesive material.

2. The apparatus of claim 1 , wherein the adhesive material is in contact with the magnetic element and a sidewall of the chassis.

3. The apparatus of claim 2 , wherein the adhesive material comprises a foaming agent.

4. The apparatus of claim 1 , wherein the adhesive material comprises one of an epoxy, an epoxy hybrid resin, or a composite resin matrix.

5. The apparatus of claim 1 , wherein the adhesive material comprises one or more of a resin, a multifunctional epoxy, anhydride, or phoenolic.

6. An imaging system, comprising:
a light emitter;
a photosensitive element; and
a light steering device, comprising:
a chassis;
a microelectromechanical (MEMS) device secured to the chassis;
a magnetic element secured to the chassis, proximate to the MEMS device; and
an adhesive material contacting the magnetic element,
wherein the MEMS device and the magnetic element are magnetically coupled, and (1) the adhesive material includes a ferromagnetic filler and is between the magnetic element and the MEMS device or (2) the magnetic element is between the MEMS device and the adhesive material.

7. The imaging system of claim 6 , wherein the adhesive material comprises one of an epoxy, an epoxy hybrid resin, or a composite resin matrix.

8. The imaging system of claim 6 , wherein the adhesive material comprises one or more of a resin, a multifunctional epoxy, anhydride, or phoenolic.

9. The imaging system of claim 6 , wherein the MEMS device comprises a magnetically controllable optical element.

10. The imaging system of claim 6 , wherein the magnetic element comprises a permanent magnet.

11. The imaging system of claim 6 , wherein the adhesive material includes a ferromagnetic filler and is between the magnetic element and the MEMS device.

12. The imaging system of claim 11 , wherein the adhesive material is in contact with the magnetic element and the MEMS device.

13. The imaging system of claim 6 , wherein the magnetic element is between the MEMS device and the adhesive material.

14. The imaging system of claim 13 , wherein the adhesive material is in contact with the magnetic element and a sidewall of the chassis.

15. The imaging system of claim 13 , wherein the adhesive material comprises a foaming agent.

16. A computing device, comprising:
a processor mounted on a substrate; and
an imaging system, the imaging system comprising:
a light emitter;
a photosensitive element; and
a light steering device, comprising:
a chassis;
a microelectromechanical system (MEMS) device secured to the chassis;
a magnetic element secured to the chassis, proximate to the MEMS device; and
an adhesive material contacting the magnetic element,
wherein the MEMS device and the magnetic element are magnetically coupled, and (1) the adhesive material includes a ferromagnetic filler and is between the magnetic element and the MEMS device or (2) the magnetic element is between the MEMS device and the adhesive material.

17. The computing device of claim 16 , wherein the MEMS device comprises a magnetically controllable optical element.

18. The computing device of claim 16 , wherein the adhesive material includes a ferromagnetic filler and is between the magnetic element and the MEMS device.

19. The computing device of claim 16 , wherein the magnetic element is between the MEMS device and the adhesive material.

20. The computing device of claim 19 , wherein the adhesive material is in contact with the magnetic element and a sidewall of the chassis.

Assignees

• Intel Corp

Inventors

• Yazzie Kyle
• Prakash Anna M
• Ramalingam Suriyakala
• Wang Liwei
• Starkston Robert
• Choudhury Arnab
• Iyer Sandeep S
• Abebaw Amanuel M
• Labanok Nick

Classifications

• B81B2201/038

  Microengines and actuators not provided for in B81B2201/031 - B81B2201/037 · CPC title

• B81C3/001

  Bonding of two components · CPC title

• B81C2203/057

  Passive alignment techniques not provided for in B81C2203/054 - B81C2203/055 · CPC title

• B81C2203/032

  Gluing · CPC title

• B81B2201/042

  Micromirrors, not used as optical switches · CPC title