Multilayer varistor
US-12334235-B2 · Jun 17, 2025 · US
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Usui Ryosuke patents
Usui Ryosuke is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Usui Ryosuke |
| Total patents | 29 |
| First publication | May 5, 2015 |
| Latest publication | Jun 17, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Multilayer varistor
US-12308146-B2 · May 20, 2025 · US
Liquid immersion cooling device
US-2025142769-A1 · May 1, 2025 · US
Thermal insulator and method for manufacturing same
US-12270502-B2 · Apr 8, 2025 · US
Multilayer varistor
US-2023274864-A1 · Aug 31, 2023 · US
Multilayer varistor
US-2023274863-A1 · Aug 31, 2023 · US
Multilayer varistor
US-2023207159-A1 · Jun 29, 2023 · US
Multilayer varistor
US-2023197321-A1 · Jun 22, 2023 · US
Multilayer electronic component production method
US-2022310291-A1 · Sep 29, 2022 · US
Reactor device
US-11443883-B2 · Sep 13, 2022 · US
Recent patents
Latest publications not already listed above.
Multilayer electronic component production method
US-11387023-B2 · Jul 12, 2022 · US
Heat insulation sheet, heat insulation body using same, and production method therefor
US-11384892-B2 · Jul 12, 2022 · US
Method for producing thermal insulation sheet
US-2022090313-A1 · Mar 24, 2022 · US
Reactor device
US-2021151237-A1 · May 20, 2021 · US
Thermal insulator and method for manufacturing same
US-2021062955-A1 · Mar 4, 2021 · US
Electronic device and method for manufacturing electronic device
US-2021050280-A1 · Feb 18, 2021 · US
Heat-insulating body, heat-insulating sheet using same, and method for manufacturing heat-insulating body
US-2021018135-A1 · Jan 21, 2021 · US
Heat insulation sheet, heat insulation body using same, and production method therefor
US-2020370701-A1 · Nov 26, 2020 · US
Thermal insulation sheet and multilayer thermal insulation sheet using same
US-2020340612-A1 · Oct 29, 2020 · US
Layered electronic component production method
US-2020194151-A1 · Jun 18, 2020 · US
Semiconductor device
US-10453776-B2 · Oct 22, 2019 · US
Semiconductor device
US-10297516-B2 · May 21, 2019 · US
Semiconductor device having a plurality of top surface connection terminals
US-10211144-B2 · Feb 19, 2019 · US
Semiconductor device
US-2018197802-A1 · Jul 12, 2018 · US
Semiconductor device
US-2018145020-A1 · May 24, 2018 · US
Semiconductor device
US-2016307822-A1 · Oct 20, 2016 · US
Device mounting board and semiconductor power module
US-9439285-B2 · Sep 6, 2016 · US
Semiconductor module and an inverter mounting said semiconductor module
US-9129933-B2 · Sep 8, 2015 · US
Element mounting substrate and semiconductor module
US-9024446-B2 · May 5, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Panasonic Ip Man Co Ltd | 29 |
| Sanyo Electric Co | 2 |
| Usui Ryosuke | 1 |
| Igarashi Yusuke | 1 |
| Inoue Yasunori | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01C1/148 | 9 |
| H01C7/18 | 9 |
| H01C7/1006 | 7 |
| H01C7/10 | 7 |
| H01C17/30 | 7 |