Element mounting substrate and semiconductor module

Patent metadata

Field	Value
Publication number	US-9024446-B2
Application number	US-201013381299-A
Country	US
Kind code	B2
Filing date	Jun 30, 2010
Priority date	Jun 30, 2009
Publication date	May 5, 2015
Grant date	May 5, 2015

Abstract

Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.

First claim

What is claimed is:

1. An element mounting substrate comprising:
at least three metal core substrates arranged in parallel with, but not stacked, each other; and
insulating resin embedded among the metal core substrates,
each metal core substrate including:
a metal core mainly composed of metal;
a first ceramic film formed on one main surface of the metal core;
a second ceramic film formed on the other main surface of the metal core;
a first insulating resin film formed on a surface of the first ceramic film; and
a second insulating resin film formed on a surface of the second ceramic film, wherein

the insulating resin between two metal core substrates adjacent to each other does not extend from one side of the element mounting substrate to an opposing side, and another metal core substrate is arranged between the one side and the opposing side so that the insulating resin is blocked by the another metal core substrate.

2. The element mounting substrate according to claim 1 , further comprising:
a first conductive pattern formed on a surface of the first insulating resin film; and
a second conductive pattern formed on a surface of the second insulating resin film.

3. The element mounting substrate according to claim 1 , wherein a thickness of the first ceramic film is greater than the thickness of the metal core.

4. The element mounting substrate according to claim 1 , wherein a thickness of the second ceramic film is greater than the thickness of the metal core.

5. The element mounting substrate according to claim 1 , wherein the metal core is formed of metal mainly made of Al, and the first ceramic film and the second ceramic film are mainly composed of an Al oxide film.

6. The element mounting substrate according to claim 1 , wherein the metal core comprises a through-hole, and an inner wall of the through-hole is coated with a ceramic film having the same components as the first ceramic film or the second ceramic film.

Assignees

• Usui Ryosuke
• Igarashi Yusuke
• Inoue Yasunori
• Nakasato Mayumi
• Nagamatsu Masayuki
• Kohara Yasuhiro
• Panasonic Ip Man Co Ltd

Inventors

• Usui Ryosuke
• Igarashi Yusuke
• Inoue Yasunori
• Nakasato Mayumi
• Nagamatsu Masayuki
• Kohara Yasuhiro

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title