Semiconductor device

Patent metadata

Field	Value
Publication number	US-10453776-B2
Application number	US-201615196153-A
Country	US
Kind code	B2
Filing date	Jun 29, 2016
Priority date	Jan 16, 2014
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A semiconductor device includes a semiconductor module including a semiconductor element, a passive element, a cooling member, a first conductive member and a second conductive member. The cooling member is disposed between the semiconductor module and the passive element. And a first conductive member and a second conductive member electrically connect the semiconductor module and the passive element. Furthermore, two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor module including a semiconductor element;
a passive element;
a cooling member disposed between the semiconductor module and the passive element; and
a first conductive member and a second conductive member for electrically connecting the semiconductor module and the passive element, wherein:
two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member,
the cooling member includes a through hole, and
at least one of the first conductive member and the second conductive member extends through the through hole of the cooling member.

2. A semiconductor device comprising:
a semiconductor module including a semiconductor element;
a passive element;
a cooling member disposed between the semiconductor module and the passive element; and
a first conductive member and a second conductive member for electrically connecting the semiconductor module and the passive element, wherein:
two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member,
the cooling member includes a cut-out portion, and
at least one of the first conductive member and the second conductive member extends through the cut-out portion of the cooling member.

3. A semiconductor device comprising:
a semiconductor module including a semiconductor element;
a passive element;
a cooling member disposed between the semiconductor module and the passive element; and
a first conductive member and a second conductive member for electrically connecting the semiconductor module and the passive element, wherein:
two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member,
the cooling member is configured from a first cooling member and a second cooling member, and
at least one of the first conductive member and the second conductive member is disposed between the first cooling member and the second cooling member.

4. A semiconductor device comprising:
a semiconductor module including a semiconductor element;
a passive element;
a cooling member disposed between the semiconductor module and the passive element; and
a first conductive member and a second conductive member for electrically connecting the semiconductor module and the passive element, wherein:
two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member, and
the first conductive member at least includes a part with a first width and a part with a second width greater than the first width, the part with the second width being disposed between the cooling member and the passive element.

5. A semiconductor device comprising:
a semiconductor module including a semiconductor element;
a passive element;
a cooling member disposed between the semiconductor module and the passive element; and
a first conductive member and a second conductive member for electrically connecting the semiconductor module and the passive element, wherein:
two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member,
the cooling member includes a channel for allowing a cooling medium to flow,
the channel includes a curved portion, and
a flow inlet of the channel and a flow outlet of the channel are disposed on one side surface of the cooling member.

6. A semiconductor device comprising:
a semiconductor module including a semiconductor element;
a passive element;
a cooling member disposed between the semiconductor module and the passive element; and
a first conductive member and a second conductive member for electrically connecting the semiconductor module and the passive element, wherein:
two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member,
the cooling member includes a channel for allowing a cooling medium to flow,
a flow inlet of the channel is disposed on one side surface of the cooling member, and
a flow outlet of the channel is disposed on the other side surface that is opposite the one side surface of the cooling member.

7. The semiconductor device according to claim 1 , wherein:
the passive element is a film capacitor, and
the film capacitor includes a core rod made of a highly thermal conductive material.

8. The semiconductor device according to claim 1 , wherein:
the passive element is a film capacitor, and
the film capacitor includes a carbon sheet.

9. The semiconductor device according to claim 1 , wherein:
the semiconductor element is disposed on a base substrate, and
the base substrate is disposed on the cooling member across a thermal conductive member.

10. A semiconductor device comprising:
a semiconductor module including a semiconductor element;
a passive element;
a cooling member disposed between the semiconductor module and the passive element; and
a first conductive member and a second conductive member for electrically connecting the semiconductor module and the passive element,
wherein the first conductive member at least includes a part with a first width and a part with a second width greater than the first width, the part with the second width being disposed between the cooling member and the passive element.

11. A semiconductor device comprising:
a semiconductor module including a semiconductor element;
a passive element;
a cooling member disposed between the semiconductor module and the passive element; and
a first conductive member and a second conductive member for electrically connecting the semiconductor module and the passive element, wherein:
the cooling member and the semiconductor module are disposed between the first conductive member and the second conductive member,
the cooling member includes a through hole, and
at least one of the first conductive member and the second conductive member extends through the through hole of the cooling member.

12. A semiconductor device comprising:
a semiconductor module including a semiconductor element;
a passive element;
a cooling member disposed between the semiconductor module and the passive element; and
a first conductive member and a second conductive member for electrically connecting the semiconductor module and the passive element, wherein:
the cooling member and the semiconductor module are disposed between the first conductive member and the second conductive member,
the cooling member includes two or more through holes, and
the first conductive member and the second conductive member respectively extend through the through holes different from one another.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Usui Ryosuke
• Ueda Tetsuzo

Classifications

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title

• H10W70/481

  for devices being provided for in groups H10D8/00 - H10D48/00 · CPC title

• H10W20/43

  Layouts of interconnections · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20927

  Liquid coolant without phase change · CPC title